Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method

ABSTRACT

An organic layer deposition apparatus, a method of manufacturing an organic light-emitting display apparatus by using the same, and an organic light-emitting display apparatus manufactured using the method. The organic layer deposition apparatus includes a conveyer unit including first and second conveyer units, loading and unloading units, and a deposition unit. A transfer unit moves between the first and second conveyer units, and the substrate attached to the transfer unit is spaced from a plurality of organic layer deposition assemblies of the deposition unit while being transferred by the first conveyer unit. The organic layer deposition assemblies include common layer deposition assemblies and pattern layer deposition assemblies.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/938,173, filed Jul. 9, 2013, which claims priority to and the benefitof Korean Patent Application No. 10-2012-0075138, filed on Jul. 10, 2012in the Korean Intellectual Property Office, Korean Patent ApplicationNo. 10-2012-0076940, filed on Jul. 13, 2012 in the Korean IntellectualProperty Office, and Korean Patent Application No. 10-2012-0110095,filed on Oct. 4, 2012, the entire contents of all of which areincorporated herein by reference.

BACKGROUND

1. Field

Aspects of embodiments of the present invention relate to an organiclayer deposition apparatus, a method of manufacturing an organiclight-emitting display apparatus (organic light-emitting display device)by using the same, and an organic light-emitting display apparatusmanufactured using the method.

2. Description of the Related Art

Organic light-emitting display apparatuses (organic light-emittingdisplay devices) have wider viewing angles, better contrastcharacteristics, and faster response speeds than other display devices,and thus they have drawn attention as a next-generation display device.

An organic light-emitting display apparatus includes intermediatelayers, which include an emission layer, located between a firstelectrode and a second electrode facing the first electrode. Theelectrodes and the intermediate layers may be formed using variousmethods, one of which is an independent deposition method. When anorganic light-emitting display apparatus is manufactured using adeposition method, a fine metal mask (FMM) having the same pattern asthat of an organic layer to be formed is positioned to closely contact asubstrate on which the organic layer and the like are to be formed, andan organic layer material is deposited through the FMM to form anorganic layer having a desired pattern.

However, the deposition method using such an FMM presents difficultiesin manufacturing large organic light-emitting display apparatuses usinga large mother glass. For example, when a large mask is used, the maskmay bend due to its own weight (self-gravity) to thereby distort apattern. Such disadvantages might make the FMM method undesirable inview of the recent trend towards high-definition patterns.

Moreover, processes of aligning a substrate and an FMM to closelycontact each other, performing deposition thereon, and separating theFMM from the substrate are time-consuming, resulting in a longmanufacturing time, and may result in low production efficiency.

Information disclosed in this Background section was already known bythe inventors of the present invention before achieving the presentinvention or is technical information acquired in the process ofachieving the present invention. Therefore, it may contain informationthat does not form the prior art that is already known in this countryto a person of ordinary skill in the art.

SUMMARY

In order to address the drawback of the deposition method using a finemetal mask (FMM) and/or other issues, aspects of the present inventionare directed toward organic layer deposition apparatuses that aresuitable for use in the mass production of a large substrate, enablehigh-definition patterning, and reduce time and costs for thecorrection/compensating for a thickness of an organic layer, methods ofmanufacturing organic light-emitting display apparatuses (organiclight-emitting display devices) by using the same, and organiclight-emitting display apparatuses manufactured using the methods.

According to an embodiment of the present invention, an organic layerdeposition apparatus is provided. The organic layer deposition apparatusincludes: a conveyer unit including a transfer unit for attaching asubstrate and configured to move along with the substrate, a firstconveyer unit for moving in a first direction the transfer unit on whichthe substrate is attached, and a second conveyer unit for moving in adirection opposite to the first direction the transfer unit from whichthe substrate is separated after deposition has been completed; aloading unit for attaching the substrate on the transfer unit; adeposition unit including a chamber configured to be maintained in avacuum state and a plurality of organic layer deposition assemblies fordepositing an organic layer on the substrate attached to the transferunit transferred from the loading unit; and an unloading unit forseparating, from the transfer unit, the substrate on which thedeposition has been completed while passing through the deposition unit,wherein the transfer unit is configured to move between the firstconveyer unit and the second conveyer unit, the transfer unit isconfigured for the attached substrate to be spaced from the plurality oforganic layer deposition assemblies while being transferred by the firstconveyer unit, each of the plurality of organic layer depositionassemblies includes: a plurality of deposition sources, each of theplurality of deposition sources being configured to discharge acorresponding one of a plurality of deposition materials; and adeposition source nozzle unit at a side of each of the depositionsources, and including one or more deposition source nozzles, theorganic layer deposition assemblies include a plurality of common layerdeposition assemblies for forming a common layer and a plurality ofpattern layer deposition assemblies for forming a pattern layer, each ofthe pattern layer deposition assemblies further includes a correctionslit sheet including a plurality of correction slits, correction slitsof the pattern layer deposition assemblies are offset with respect toeach other along the first direction, and the deposition materialsdischarged from the deposition sources pass through respective saidcorrection slit sheets and are deposited in a pattern on the substrate.

In one embodiment, each of the correction slits extends in the firstdirection.

Locations of the correction slits of the correction slit sheets indifferent pattern layer deposition assemblies may be different from eachother in the first direction.

Pattern layers deposited on the substrate through the correction slitsheets may not overlap each other.

The correction slits of the correction slit sheets may have equallengths.

The correction slits of the correction slit sheets may have differentlengths.

A length of the correction slits of the correction slit sheets mayincrease as the correction slits are farther away from respectivecenters of the correction slit sheets.

The organic layer deposition apparatus may further include a correctionplate located at a side of a corresponding one of the correction slitsheets and shielding at least a portion of the deposition materialdischarged from the deposition source.

A width of the correction plate may decrease from a center towards anedge of a corresponding one of the correction slit sheets.

The correction plate may have a shape of a circular arc or cosine.

A width of the correction plate at a region corresponding to a center ofa corresponding one of the correction slit sheets may be greater thanthat at an edge of the correction plate.

The correction plate may have a shape such that the deposition materialis better shielded at a center of the correction slit sheet than at anedge of the correction slit sheet.

The first conveyer unit and the second conveyer unit may be configuredto pass through the deposition unit.

The first conveyer unit and the second conveyer unit may be arranged oneon top of the other and may be parallel to each other.

The first conveyer unit may be configured to move the transfer unit tosequentially pass through the loading unit, the deposition unit, and theunloading unit in that order.

The second conveyer unit may be configured to move the transfer unit tosequentially pass through the unloading unit, the deposition unit, andthe loading unit in this stated order.

A length of the correction slit sheets of the organic layer depositionassemblies in at least one of the first direction or the seconddirection may be smaller than that of the substrate.

According to another embodiment of the present invention, a method ofmanufacturing an organic light-emitting display apparatus by using anorganic layer deposition apparatus for forming an organic layer on asubstrate, is provided. The method includes: attaching a substrate to atransfer unit in a loading unit; transporting, into a chamber, thetransfer unit to which the substrate is attached, by using a firstconveyer unit passing through the chamber; depositing depositionmaterials discharged from a plurality of organic layer depositionassemblies to form organic layers on the substrate while the substrateis moved relative to the organic layer deposition assemblies, theorganic layer deposition assemblies being in the chamber and spacedapart from the substrate; separating from the transfer unit thesubstrate on which the depositing has been completed in an unloadingunit; and transporting the transfer unit from which the substrate isseparated to the loading unit by using a second conveyer unit installedto pass through the chamber, wherein each of the plurality of organiclayer deposition assemblies includes: a plurality of deposition sources,each of the plurality of deposition sources being configured todischarge a corresponding one of a plurality of deposition materials;and a deposition source nozzle unit at a side of each of the depositionsources, and including one or more deposition source nozzles, theorganic layer deposition assemblies include a plurality of common layerdeposition assemblies for forming a common layer and a plurality ofpattern layer deposition assemblies for forming a pattern layer, each ofthe pattern layer deposition assemblies further includes a correctionslit sheet including a plurality of correction slits, the correctionslits of the pattern layer deposition assemblies are offset with respectto each other along a first direction in which the substrate istransported, and the substrate is spaced apart from the organic layerdeposition apparatus so as to be relatively movable with respect to theorganic layer deposition apparatus, and the deposition materialsdischarged from the deposition sources pass through respective saidcorrection slit sheets and are deposited in a pattern on the substrate.

The chamber may accommodate the organic layer deposition assemblies withwhich deposition is continuously performed on the substrate.

The transfer unit may circulate between the first conveyer unit and thesecond conveyer unit.

The first conveyer unit and the second conveyer unit may be arranged inparallel and one on top of the other.

A length of patterning slit sheets of the organic layer depositionassemblies in at least one of the first direction or a second directionperpendicular to the first direction may be less than that of thesubstrate.

According to another embodiment of the present invention, an organiclight-emitting display apparatus includes: a substrate; a plurality ofthin film transistors on the substrate and each including asemiconductor active layer, a gate electrode insulated from thesemiconductor active layer, and source and drain electrodes eachcontacting the semiconductor active layer; a plurality of pixelelectrodes respectively on the thin film transistors; a plurality oforganic layers respectively on the plurality of pixel electrodes; and acounter electrode on the plurality of organic layers, wherein a lengthof a slanted side between a top side and a bottom side of at least oneof the organic layers on the substrate farther from a center of adeposition region is greater than lengths of slanted sides of other onesof the organic layers formed closer to the center of the depositionregion, and the at least one of the organic layers on the substrate is alinearly-patterned organic layer formed using the organic layerdeposition apparatus described above.

The substrate may have a size of 40 inches or more.

Each of the organic layers may include at least an emission layer.

The organic layers may have a non-uniform thickness.

Among the organic layers located in the deposition region, an organiclayer located farther from the center of the deposition region may havea narrower interval between facing sides of a pattern of the organiclayer extending in the first direction than the organic layers locatedcloser to the center.

The farther the organic layer in the deposition region is from thecenter of the deposition region, the narrower an overlapping region oftwo sides of the organic layer may be.

Slanted sides between top and bottom side of the organic layer disposedat the center of the deposition region may have substantially equallengths.

The organic layers in the deposition region may be symmetricallyarranged about the center of the deposition region.

According to another embodiment of the present invention, an organiclayer deposition apparatus is provided. The organic layer depositionapparatus includes: a conveyer unit including a transfer unit forattaching a substrate and configured to move along with the substrate, afirst conveyer unit for moving in a first direction the transfer unit onwhich the substrate is attached, and a second conveyer unit for movingin a direction opposite to the first direction the transfer unit fromwhich the substrate is separated after deposition has been completed; aloading unit for attaching the substrate to the transfer unit; adeposition unit including a chamber maintained in a vacuum state and aplurality of organic layer deposition assemblies for depositing organiclayers on the substrate attached to the transfer unit transferred fromthe loading unit; and an unloading unit for separating, from thetransfer unit, the substrate on which the deposition has been completedwhile passing through the deposition unit. The transfer unit isconfigured to move between the first conveyer unit and the secondconveyer unit, and the substrate attached to the transfer unit isconfigured to be spaced from the plurality of organic layer depositionassemblies while being transferred by the first conveyer unit. Each ofthe plurality of organic layer deposition assemblies includes: aplurality of deposition sources, each of the plurality of depositionsources being configured to discharge a corresponding one of a pluralityof deposition materials; a deposition source nozzle unit at a side ofeach of the plurality of deposition sources and including one or moredeposition source nozzles; a patterning slit sheet facing the depositionsource nozzle unit and including one or more patterning slits; and amodification shutter located between the plurality of deposition sourcesand the patterning slit sheet and including an opening that isconfigured to allow the deposition material to pass-through towards thepatterning slit sheet. The openings of adjacent ones of the modificationshutters are offset from each other along a second directionperpendicular to the first direction, and the deposition materialsdischarged from the plurality of deposition sources pass through thepatterning slit sheet and are deposited on the substrate in patterns.

The opening of the modification shutter may be elongated in the firstdirection.

Locations of the openings of the modification shutters may be differentfrom each other.

The patterns deposited on the substrate through the openings may notoverlap each other.

In one embodiment, when thicknesses of the plurality of organic layersare measured, a modifying substrate is transferred through the organiclayer deposition apparatus, and the modification shutter is locatedbetween the plurality of deposition sources and the patterning slitsheet such that the deposition materials are deposited on the modifyingsubstrate by passing through the opening of the modification shutter.

The deposition unit may include m organic layer deposition assemblies,each of the m organic layer deposition assemblies may include ndeposition sources, and each of the m organic layer depositionassemblies may include one modification shutter, wherein m and n arenatural numbers.

In one embodiment, when the thicknesses of the plurality of organiclayers are measured, the (n−1)th deposition source is activated, and themodifying substrate is transferred in the first direction and thedeposition material is deposited on the modifying substrate from theactivated (n−1)th deposition source while the deposition materials ofthe deposition sources other than the (n−1)th deposition source areblocked from reaching the modifying substrate, and after the modifyingsubstrate is out of the deposition unit, the (n)th deposition source isactivated, and the modifying substrate is transferred in the firstdirection and the deposition material is deposited on the modifyingsubstrate from the activated (n)th deposition source while thedeposition materials of the deposition sources other than the (n)thdeposition source are blocked from reaching the modifying substrate.

Each of the plurality of organic layer deposition assemblies may includea same number of the plurality of deposition sources, and a number ofmodifying substrates used to measure the thicknesses of the organiclayers and the number of the plurality of deposition sources may besame.

The first conveyer unit and the second conveyer unit may be configuredto pass through the deposition unit.

The first conveyer unit and the second conveyer unit may be arrangedparallel to each other one on top of the other.

The first conveyer unit may be configured to sequentially transfer thetransfer unit into the loading unit, the deposition unit, and theunloading unit.

The second conveyer unit may be configured to sequentially transport thetransfer unit into the unloading unit, the deposition unit, and theloading unit.

The patterning slit sheet of each of the plurality of organic layerdeposition assemblies may be smaller than the substrate in at least oneof the first direction or the second direction perpendicular to thefirst direction.

The deposition source nozzle unit may include a plurality of depositionsource nozzles arranged along the second direction perpendicular to thefirst direction, the patterning slit sheet may include a plurality ofpatterning slits arranged along the second direction, and the organiclayer deposition apparatus may further include a shielding plateassembly arranged along the second direction between the depositionsource nozzle unit and the patterning slit sheet and including aplurality of shielding plates for defining a space between thedeposition source nozzle unit and the patterning slit sheet to aplurality of deposition spaces.

Each of the plurality of shielding plates may extend along the firstdirection.

The shielding plate assembly may include a first shielding plateassembly including a plurality of first shielding plates and a secondshielding plate assembly including a plurality of second shieldingplates.

Each of the plurality of first shielding plates and each of theplurality of second shielding plates may be arranged along the seconddirection such as to define the space between the deposition sourcenozzle unit and the patterning slit sheet to the plurality of depositionspaces.

The deposition source nozzle unit may include a plurality of depositionsource nozzles arranged along the first direction, and the patterningslit sheet may have a plurality of patterning slits arranged along thesecond direction perpendicular to the first direction.

The plurality of deposition sources, the deposition source nozzle unit,and the patterning slit sheet may be integrally formed by beingconnected to each other via a connecting member.

The connecting member may be configured to guide a flow path of thedeposition material.

The connecting member may be configured to seal a space between thedeposition source nozzle and the patterning slit sheet.

In another embodiment according to the present invention, a method ofmanufacturing an organic light-emitting display apparatus by using anorganic layer deposition apparatus for forming an organic layer on asubstrate is provided. The method includes: attaching the substrate to atransfer unit in a loading unit; transporting, into a chamber, thetransfer unit to which the substrate is attached, by using a firstconveyer unit passing through the chamber; forming organic layers bydepositing deposition materials discharged from a plurality of organiclayer deposition assemblies on the substrate while the substrate isspaced apart from and moved relative to the organic layer depositionassemblies in the chamber; separating the substrate on which thedepositing has been completed from the transfer unit in an unloadingunit; and transporting the transfer unit from which the substrate isseparated to the loading unit by using a second conveyer unit passingthrough the chamber. Each of the organic layer deposition assembliesincludes: a plurality of deposition sources, each of the depositionsources being configured to discharge a corresponding one of thedeposition materials; a deposition source nozzle unit at a side of eachof the plurality of deposition sources and comprising one or moredeposition source nozzles; a patterning slit sheet facing the depositionsource nozzle unit and comprising one or more patterning slits; and amodification shutter located between the plurality of deposition sourcesand the patterning slit sheet and having an opening that is configuredto allow the corresponding ones of the deposition materials from thedeposition sources to pass-through towards the patterning slit sheet.The openings of adjacent ones of the modification shutters are offsetfrom each other along a second direction perpendicular to a firstdirection in which the substrate is transported, and the depositionmaterials discharged from the plurality of deposition sources passthrough the patterning slit sheet and are deposited on the substrate inpatterns.

The chamber may include a plurality of the organic layer depositionassemblies, and wherein deposition may be sequentially performed on thesubstrate by using each of the plurality of the organic layer depositionassemblies.

The transfer unit may be moved between the first conveyer unit and thesecond conveyer unit.

The first conveyer unit and the second conveyer unit may be arranged inparallel to each other above and below.

The patterning slit sheet of the organic layer deposition assembly maybe formed smaller than the substrate in at least one of a firstdirection or the second direction perpendicular to the first direction.

In another embodiment according to the present invention, an organiclight-emitting display apparatus is provided. The organic light-emittingdisplay apparatus includes: a substrate; at least one thin filmtransistor on the substrate and including a semiconductor active layer,a gate electrode insulated from the semiconductor active layer, andsource and drain electrodes each contacting the semiconductor activelayer; a plurality of pixel electrodes on the at least one thin filmtransistor; a plurality of organic layers on the plurality of the pixelelectrodes; and a counter electrode located on the plurality of organiclayers. A length of a slanted side between top and bottom sides of atleast one of the plurality of organic layers on the substrate fartherfrom a center of a deposition region is larger than lengths of slantedsides between respective top and bottom sides of other ones of theplurality of organic layers formed closer to the center of thedeposition region, and the at least one of the plurality of organiclayers on the substrate is a linearly-patterned organic layer formedusing an organic layer deposition apparatus described above.

The substrate may have a size of 40 inches or more.

The plurality of organic layers may include at least an emission layer.

The plurality of organic layers may have a non-uniform thickness.

In each of the organic layers formed farther from the center of thedeposition region, the slanted side farther from the center of thedeposition region may be larger than the other slanted side.

The further one of the plurality of organic layers in the depositionregion is from the center of the deposition region, the narrower anoverlapped region of two sides of the one of the plurality of organiclayers may be formed.

The slanted sides of the organic layer disposed at the center of thedeposition region may have substantially the same length.

The plurality of organic layers in the deposition region may besymmetrically arranged about the center of the deposition region.

According to another embodiment of the present invention, there isprovided an apparatus for organic layer deposition including a conveyerunit including a transfer unit on which a substrate is fixed to movetherewith; a first conveyer unit, which moves the transfer unit on whichthe substrate is fixed in a first direction; and a second conveyer unit,which moves the transfer unit from which the substrate is detached afterdeposition in a direction opposite to the first direction; and adeposition unit including a chamber maintained at a vacuum; and one ormore organic layer deposition assemblies which deposit organic materiallayers on the substrate fixed to the transfer unit, wherein the organiclayer deposition assembly includes a deposition source, which emits adeposition material; a deposition source nozzle unit, which is arrangedon one side of the deposition source, the deposition source nozzle unitincluding a plurality of deposition source nozzles; a patterning slitsheet, which is arranged to face the deposition source nozzle unit, thepatterning slit sheet including a plurality of patterning slits arrangedin a direction; and a first tooling shutter, which is arranged betweenthe deposition source and the patterning slit sheet to cover at least aportion of the substrate, the first tooling shutter including one ormore tooling slits formed in the first direction, wherein the transferunit is able to move back and forth between the first conveyer unit andthe second conveyer unit, and the substrate that is fixed to thetransfer unit is a set distance apart from the organic layer depositionassemblies while being transported by the first conveyer unit.

The first tooling shutter may be arranged at each of the plurality oforganic layer deposition assemblies, and the tooling slits formed ineach of the first tooling shutters may be formed to be offset to oneanother.

The first tooling shutter may be arranged at the organic layerdeposition assembly for depositing a common layer, among the pluralityof organic layer deposition assemblies.

In one embodiment, the first tooling shutter is arranged to cover atleast a portion of the substrate only when the substrate for tooling istransported in the deposition unit.

In the organic layer deposition assembly for depositing a pattern layeraccording to one embodiment, among the plurality of organic layerdeposition assemblies, a second tooling shutter, which is arrangedbetween the deposition source and the patterning slit sheet to cover atleast a portion of the substrate and including tooling slits at twoopposite ends along the first direction, is further formed.

A width of the tooling slit of the second tooling shutter may be greaterthan a width of the patterning slit of the patterning slit sheet.

In one embodiment, the first conveyer unit and the second conveyer unitare arranged to pass through the deposition unit.

In one embodiment, the first conveyer unit and the second conveyer unitare arranged next to each other in a vertical direction.

In one embodiment, the apparatus further includes a loading unit inwhich the substrate is fixed to the transfer unit; and an unloading unitin which the substrate is detached from the transfer unit after thesubstrate passes through the deposition unit and deposition thereon iscompleted.

In one embodiment, the first conveyer unit moves the transfer unit tothe loading unit, the deposition unit, and the unloading unit in theorder stated.

In one embodiment, the second conveyer unit moves the transfer unit tothe unloading unit, the deposition unit, and the loading unit in theorder stated

In the organic layer deposition assemblies according to one embodiment,the deposition material emitted by the deposition source passes throughthe patterning slit sheet and is deposited to form a pattern on thesubstrate.

In one embodiment, the patterning slit sheet of the organic layerdeposition assemblies is smaller than the substrate.

In one embodiment, a magnetic rail is formed in a surface of thetransfer unit, a plurality of coils are formed at each of the firstconveyer unit and the second conveyer unit, and the magnetic rail andthe coils are combined with each other and constitute a driving unitwhich generates driving power for moving the transfer unit.

In one embodiment, the plurality of deposition source nozzles are formedat the deposition source nozzle unit in the first direction, and theplurality of patterning slits are formed at the patterning slit sheet inthe first direction. The apparatus further includes a shielding plateassembly, which includes a plurality of shielding plates that arearranged between the deposition source nozzle unit and the patterningslit sheet in the first direction and defines the space between thedeposition source nozzle unit and the patterning slit sheet into aplurality of deposition spaces.

In one embodiment, each of the plurality of shielding plates extends ina second direction substantially perpendicular to the first direction.

In one embodiment, the shielding plate assembly includes a firstshielding plate assembly including a plurality of first shieldingplates; and a second shielding plate assembly including a plurality ofsecond shielding plates.

In one embodiment, the plurality of deposition source nozzles are formedat the deposition source nozzle unit in the first direction, and theplurality of patterning slits are formed at the patterning slit sheet ina second direction perpendicular to the first direction.

In one embodiment, the deposition source, the deposition source nozzleunit, and the patterning slit sheet are connected to one another via aconnecting member and are formed as a single body.

In one embodiment, the connecting member guides a path in which thedeposition material moves.

In one embodiment, the connecting member is formed to seal a spaceformed by the deposition source, the deposition source nozzle unit, andthe patterning slit from outside.

According to another embodiment of the present invention, there isprovided a method of using the apparatus for organic layer depositionfor forming an organic material layer on a substrate, the methodincluding an operation in which, while a substrate is fixed to atransfer unit, the transfer unit is transported into a chamber by afirst conveyer unit that is configured to pass through the chamber; anoperation in which, when a plurality of organic layer depositionassemblies are a set or predetermined distance apart from the substrate,the substrate moves relative to the organic layer deposition assembliesand organic material layers are formed as deposition materials emittedby the organic layer deposition assemblies are deposited on thesubstrate; and an operation in which the transfer unit from which thesubstrate is detached is transported back by a second conveyer unit thatis configured to pass through the chamber, wherein the operation inwhich the organic material layer is formed includes an operation inwhich, while a substrate for tooling is being transported in the organiclayer deposition assemblies, the deposition material is deposited ontothe tooling substrate by a first tooling shutter in which one or moretooling slits are formed.

In one embodiment, the first tooling shutter is arranged in each of theplurality of organic layer deposition assemblies, and the tooling slitsformed in the first tooling shutters are formed to be somewhat offset toone another.

In one embodiment, the first tooling shutter is arranged in an organiclayer deposition assembly for depositing a common layer, among theplurality of organic layer deposition assemblies.

In one embodiment, the first tooling shutter is arranged to cover atleast a portion of the substrate only while the tooling substrate isbeing transported in the organic layer deposition assemblies.

In one embodiment, the method further includes an operation in which thesubstrate is fixed to the transfer unit at the loading unit before thetransfer unit is transported by the first conveyer unit; and anoperation in which the substrate, to which deposition is completed, isdetached from the transfer unit at the unloading unit before thetransfer unit is transported back by the second conveyer unit.

In one embodiment, the transfer unit moves back and forth between thefirst conveyer unit and the second conveyer unit.

In one embodiment, the first conveyer unit and the second conveyer unitare arranged next to each other in a vertical direction.

In one embodiment, each of the organic layer deposition assembliesincludes a deposition source, which emits a deposition material; adeposition source nozzle unit, which is arranged at one side of thedeposition source, the deposition source nozzle unit including aplurality of deposition source nozzles; a patterning slit sheet, whichis arranged to face the deposition source nozzle unit, the patterningslit sheet including a plurality of patterning slits arranged in adirection, and the deposition material emitted by the deposition sourcepasses through the patterning slit sheet and is deposited to form apattern on the substrate.

In an organic layer deposition assembly for depositing a pattern layeramong the plurality of organic layer deposition assemblies according toone embodiment, a second tooling shutter, which is arranged between thedeposition nozzle and the patterning slit sheet to cover at least aportion of the substrate and includes tooling slits formed at twoopposite ends, is formed.

In one embodiment, a width of the tooling slit of the second toolingshutter is greater than a width of the patterning slit of the patterningslit sheet.

In one embodiment, the patterning slit sheet of the organic layerdeposition assembly is formed smaller than the substrate in at least anyone of the first direction and the second direction perpendicular to thefirst direction.

According to another embodiment of the present invention, there isprovided an organic light-emitting display device including a substrate;at least one thin film transistor that is disposed on the substrate andincludes a semiconductor active layer, a gate electrode insulated fromthe semiconductor active layer, and source and drain electrodes eachcontacting the semiconductor active layer; a plurality of pixelelectrodes disposed on the at least one thin film transistor; aplurality of organic layers disposed on the plurality of the pixelelectrodes; and a counter electrode disposed on the plurality of organiclayers, wherein a length of a slanted side between top and bottom sidesof at least one of the plurality of organic layers formed on thesubstrate farther from a center of a deposition region is larger thanslated sides between respective top and bottom sides of the otherorganic layers formed closer to the center of the deposition region,wherein the at least one of the plurality of organic layers formed onthe substrate is a linearly-patterned organic layer formed using theorganic layer deposition apparatus above.

In one embodiment, the substrate has a size of 40 inches or more.

In one embodiment, the plurality of organic layers include at least anemission layer.

In one embodiment, the plurality of organic layers have a non-uniformthickness.

According to one embodiment, in each of the organic layers formedfarther from the center of the deposition region, the slanted sidefarther from the center of the deposition region is larger than theother slanted sides.

In one embodiment, the further one of the plurality of organic layersformed in the deposition region is from the center of the depositionregion, the narrower an overlapped region of two sides of the one of theplurality of organic layers is formed.

In one embodiment, hypotenuses of the organic layer disposed at thecenter of the deposition region have substantially the same length.

In one embodiment, the plurality of organic layers disposed in thedeposition region are symmetrically arranged about the center of thedeposition region.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and aspects of the present invention willbecome more apparent by describing in detail embodiments thereof withreference to the attached drawings in which:

FIG. 1 is a schematic plan view illustrating a structure of an organiclayer deposition apparatus according to an embodiment of the presentinvention;

FIG. 2 is a schematic side view of a deposition unit of the organiclayer deposition apparatus of FIG. 1, according to an embodiment of thepresent invention;

FIG. 3 is a schematic perspective view of the deposition unit of theorganic layer deposition apparatus of FIG. 1, according to an embodimentof the present invention;

FIG. 4 is a schematic cross-sectional view of the deposition unit ofFIG. 3, according to an embodiment of the present invention;

FIG. 5 is a perspective view of a deposition source of the depositionunit of FIG. 3, according to an embodiment of the present invention;

FIG. 6 is a perspective view of a deposition source of the depositionunit of FIG. 3, according to another embodiment of the presentinvention;

FIG. 7 is a schematic cross-sectional view of a first conveyer unit anda transfer unit of the deposition unit of FIG. 3 according to anembodiment of the present invention;

FIG. 8 is a schematic perspective view of a tooling shutter while thedeposition unit of FIG. 3 is depositing an organic material layeraccording to an embodiment of the present invention;

FIG. 9 is a schematic perspective view of a tooling shutter while thedeposition unit of FIG. 3 in a tooling operation according to anembodiment of the present invention;

FIG. 10 is a schematic view showing that, during the tooling operationof FIG. 9, an organic material layer is formed as a substrate passesthrough a first organic layer deposition assembly according to anembodiment of the present invention;

FIG. 11 is a schematic view showing that, during the tooling operationof FIG. 9, an organic material layer is formed as a substrate passesthrough a second organic layer deposition assembly according to anembodiment of the present invention;

FIG. 12 is a schematic view showing that, during the tooling operationof FIG. 9, an organic material layer is formed as a substrate passesthrough a third organic layer deposition assembly according to anembodiment of the present invention;

FIG. 13 is a schematic perspective view of deposition assembliesincluding deposition sources, according to an embodiment of the presentinvention;

FIG. 14 is a schematic plan view of examples of correction slit sheets;

FIG. 15 is a schematic plan view of other examples of correction slitsheets;

FIG. 16 is a schematic perspective view of deposition assemblies eachincluding a deposition unit, according to an embodiment of the presentinvention;

FIGS. 17 and 18 are schematic plan views illustrating operations ofmodification shutters, according to an embodiment of the presentinvention;

FIG. 19 is a schematic view of an organic layer deposition assemblyaccording to another embodiment of the present invention;

FIG. 20 is a schematic side-sectional view of the organic layerdeposition assembly of FIG. 19;

FIG. 21 is a schematic plan sectional view of the organic layerdeposition assembly of FIG. 19;

FIG. 22 is a schematic view of an organic layer deposition assemblyaccording to another embodiment of the present invention;

FIG. 23 is a schematic view of an organic layer deposition assemblyaccording to another embodiment of the present invention;

FIG. 24 is a schematic view illustrating equidistant patterning slits ofa patterning slit sheet of the organic layer deposition apparatus ofFIG. 3;

FIG. 25 is a schematic view of organic layers that are formed by usingthe patterning slit sheet of FIG. 24; and

FIG. 26 is a cross-sectional view of an active matrix-type organiclight-emitting display apparatus that is manufactured using an organiclayer deposition apparatus according to an embodiment of the presentinvention.

DETAILED DESCRIPTION

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items. Expressions such as “atleast one of,” when preceding a list of elements, modify the entire listof elements and do not modify the individual elements of the list.

Reference will now be made in detail to embodiments of the presentinvention, examples of which are illustrated in the accompanyingdrawings, wherein like reference numerals refer to like elementsthroughout. The embodiments are described below in order to explainaspects of the present invention by referring to the figures.

FIG. 1 is a schematic plan view illustrating a structure of an organiclayer deposition apparatus 1 according to an embodiment of the presentinvention. FIG. 2 is a schematic side view of a deposition unit 100 ofthe organic layer deposition apparatus 1 of FIG. 1, according to anembodiment of the present invention.

Referring to FIGS. 1 and 2, the organic layer deposition apparatus 1includes the deposition unit 100, a loading unit 200, an unloading unit300, and a conveyer unit 400 (refer to FIGS. 3 and 4).

The loading unit 200 may include a first rack 212, a transport chamber214, a first inversion chamber 218, and a buffer chamber 219.

A plurality of substrates 2 (for example, one substrate 2 is shown inFIGS. 3 and 4) onto which a deposition material has not yet been appliedare stacked up on the first rack 212. A transport robot included in thetransport chamber 214 picks up one of the substrates 2 from the firstrack 212, places the substrate 2 on a transfer unit 430 transferred by asecond conveyer unit 420, and moves the transfer unit 430, on which thesubstrate 2 is placed, into the first inversion chamber 218.

The first inversion chamber 218 is located adjacent to the transportchamber 214. The first inversion chamber 218 includes a first inversionrobot that inverts the transfer unit 430 and then loads it on a firstconveyer unit 410 of the deposition unit 100.

Referring to FIG. 1, the transport robot of the transport chamber 214places one of the substrates 2 on a top surface of the transfer unit430, and the transfer unit 430, on which the substrate 2 is placed, isthen transferred into the first inversion chamber 218. The firstinversion robot of the first inversion chamber 218 inverts the transferunit 430 so that the substrate 2 is turned upside down in the depositionunit 100.

The unloading unit 300 is configured to operate in an opposite manner tothe loading unit 200 described above. For example, a second inversionrobot in a second inversion chamber 328 inverts the substrate 2 and thetransfer unit 430, which have passed through the deposition unit 100,and then moves the substrate 2 and the transfer unit 430 to an ejectionchamber 324. Then, an ejection robot takes the substrate 2 and thetransfer unit 430 out of the ejection chamber 324, separates thesubstrate 2 from the transfer unit 430, and then loads the substrate 2on a second rack 322. The transfer unit 430, from which the substrate 2is separated, is returned to the loading unit 200 via the secondconveyer unit 420.

However, the present invention is not limited to the above example. Forexample, when placing the substrate 2 on the transfer unit 430, thesubstrate 2 may be fixed (or attached) onto a bottom surface of thetransfer unit 430 and then moved into the deposition unit 100. In suchan embodiment, for example, the first inversion robot of the firstinversion chamber 218 and the second inversion robot of the secondinversion chamber 328 may be omitted.

The deposition unit 100 may include at least one chamber for deposition.In one embodiment, as illustrated in FIGS. 1 and 2, the deposition unit100 includes a chamber 101 in which a plurality of organic layerdeposition assemblies (100-1), (100-2) through (100-n) may be located.Referring to FIG. 1, 11 organic layer deposition assemblies, i.e., anorganic layer deposition assembly (100-1), an organic layer depositionassembly (100-2), through an organic layer deposition assembly (100-11),are located in the chamber 101, but the number of organic layerdeposition assemblies may vary with a desired deposition material anddeposition conditions. The chamber 101 is maintained in vacuum duringthe deposition process. According to an embodiment of the presentinvention, the organic layer deposition assemblies (For example, see100-1, 100-2, through 100-11 of FIG. 7) may include a plurality ofcommon layer deposition assemblies (100-1, 100-2, 100-3, 100-4, 100-10,and 100-11 of FIG. 7) for forming common layers and a plurality ofpattern layer deposition assemblies (100-5, 100-6, 100-7, 100-8, and100-9 of FIG. 7) for forming the pattern layers This will be describedlater.

In the embodiment illustrated in FIG. 1, the transfer unit 430 with thesubstrate 2 fixed thereon (or attached thereto) may be moved at least tothe deposition unit 100 or may be moved sequentially to the loading unit200, the deposition unit 100, and the unloading unit 300, by the firstconveyer unit 410, and the transfer unit 430 from which the substrate 2is separated in the unloading unit 300 may be moved back to the loadingunit 200 by the second conveyer unit 420.

The first conveyer unit 410 passes through the chamber 101 when passingthrough the deposition unit 100, and the second conveyer unit 420conveys (or transports) the transfer unit 430 from which the substrate 2is separated.

In the present embodiment, the organic layer deposition apparatus 1 isconfigured such that the first conveyer unit 410 and the second conveyerunit 420 are respectively disposed above and below so that after thesubstrate 2 is separated from the transfer unit 430, on which depositionhas been completed while passing through the first conveyer unit 410,the transfer unit 430 is returned to the loading unit 200 via the secondconveyer unit 420 formed below the first conveyer unit 410, and thus,the organic layer deposition apparatus 1 may have an improved spaceutilization efficiency. In other words, the first and second conveyerunits 410 and 420 are arranged in parallel, one on top of the other.

In an embodiment, the deposition unit 100 illustrated in FIG. 1 mayfurther include a deposition source replacement unit 190 located at aside of each organic layer deposition assembly 100-n. Although notparticularly illustrated in the drawings, the deposition sourcereplacement unit 190 may be formed as a cassette-type that may be drawnto the outside from each organic layer deposition assembly. Thus, adeposition source 110 (refer to FIG. 3) of the organic layer depositionassembly 100-1 may be replaced with relative ease.

FIG. 1 illustrates the organic layer deposition apparatus 1 in which twosets of structures each including the loading unit 200, the depositionunit 100, the unloading unit 300, and the conveyer unit 400 are arrangedin parallel. That is, it is seen that two organic layer depositionapparatuses 1 are respectively arranged side-by-side (above and below inFIG. 1). In such an embodiment, a patterning slit sheet replacement unit500 may be further located between the two organic layer depositionapparatuses 1. That is, due to this configuration of structures, the twoorganic layer deposition apparatuses 1 share the patterning slit sheetreplacement unit 500, resulting in improved space utilizationefficiency, as compared to a case where each organic layer depositionapparatus 1 includes a patterning slit sheet replacement unit 500.

FIG. 3 is a schematic perspective view of the deposition unit 100 of theorganic layer deposition apparatus 1 of FIG. 1, according to anembodiment of the present invention. FIG. 4 is a schematiccross-sectional view of the deposition unit 100 of FIG. 3, according toan embodiment of the present invention.

Referring to FIGS. 3 and 4, the deposition unit 100 of the organic layerdeposition apparatus 1 includes at least one organic layer depositionassembly 100-1 and the conveyer unit 400.

Hereinafter, an overall structure of the deposition unit 100 will bedescribed.

The chamber 101 may be formed as a hollow box type and may include theat least one organic layer deposition assembly 100-1 and the conveyerunit 400. A foot 102 is formed so as to fix the deposition unit 100 onthe ground, a lower housing 103 is located on the foot 102, and an upperhousing 104 is located on the lower housing 103. The chamber 101accommodates both the lower housing 103 and the upper housing 104. Inthis regard, a connection part of the lower housing 103 and the chamber101 is sealed so that the inside of the chamber 101 is completelyisolated from the outside. Due to the structure in which the lowerhousing 103 and the upper housing 104 are located on the foot 102 fixedon the ground, the lower housing 103 and the upper housing 104 may bemaintained in a fixed position even though the chamber 101 is repeatedlycontracted and expanded. Thus, the lower housing 103 and the upperhousing 104 may serve as a reference frame in the deposition unit 100.

The upper housing 104 includes the organic layer deposition assembly100-1 and the first conveyer unit 410 of the conveyer unit 400, and thelower housing 103 includes the second conveyer unit 420 of the conveyerunit 400. While the transfer unit 430 is cyclically moving between thefirst conveyer unit 410 and the second conveyer unit 420, a depositionprocess is continuously performed.

Hereinafter, constituents of the organic layer deposition assembly 100-1are described in detail.

The organic layer deposition assembly 100-1 includes the depositionsource 110, a deposition source nozzle unit 120, a patterning slit sheet130, a shielding member 140, a first stage 150, a second stage 160, acamera(s) 170, and a sensor(s) 180. In this regard, all the elementsillustrated in FIGS. 3 and 4 may be arranged in the chamber 101maintained in an appropriate vacuum state. This structure is used toachieve the linearity of a deposition material.

For example, in order to deposit a deposition material 115 that has beendischarged from the deposition source 110 and passed through thedeposition source nozzle unit 120 and the patterning slit sheet 130,onto the substrate 2 in a desired pattern, it is desirable to maintainthe vacuum state of the chamber (not shown) at high levels as those usedin a fine metal mask (FMM) deposition method. In addition, thetemperature of the patterning slit sheet 130 should be sufficientlylower than that of the deposition source 110 because thermal expansionof the patterning slit sheet 130 is reduced or minimized when thetemperature of the patterning slit sheet 130 is sufficiently low.

The substrate 2, on which the deposition material 115 is to bedeposited, is arranged in the chamber 101. The substrate 2 may be asubstrate for a flat panel display apparatus (device). For example, alarge substrate, such as a mother glass, for manufacturing a pluralityof flat panel displays, may be used as the substrate 2.

According to the present embodiment, the deposition process may beperformed by moving the substrate 2 relative to the organic layerdeposition assembly 100-1.

In a conventional deposition method using an FMM, the size of the FMM isthe same as that of a substrate. Thus, as the size of the substrateincreases, the size of the FMM also increases. Due to these problems, itis difficult to fabricate the FMM and to align the FMM in a precisepattern by elongating the FMM.

To address these problems, in the organic layer deposition assembly100-1 according to the present embodiment, deposition may be performedwhile the organic layer deposition assembly 100-1 and the substrate 2are moved relative to each other. In other words, deposition may becontinuously performed while the substrate 2, which faces the organiclayer deposition assembly 100-1, is moved in a Y-axis direction. Thatis, deposition is performed in a scanning manner while the substrate 2is moved in a direction of arrow A illustrated in FIG. 3. Although thesubstrate 2 is illustrated as moving in the Y-axis direction in thechamber 101 in FIG. 3 when deposition is performed, the presentinvention is not limited thereto. For example, deposition may beperformed while the substrate 2 is fixed and the organic layerdeposition assembly 100-1 is moved in the Y-axis direction.

Thus, in the organic layer deposition assembly 100-1, the patterningslit sheet 130 may be smaller (e.g., much smaller) than an FMM used in aconventional deposition method. In other words, in the organic layerdeposition assembly 100-1, deposition is continuously performed, i.e.,in a scanning manner while the substrate 2 is moved in the Y-axisdirection. Thus, at least one of the lengths of the patterning slitsheet 130 in X-axis and Y-axis directions may be less (e.g., much less)than a length of the substrate 2 in the same direction. Because thepatterning slit sheet 130 may be formed smaller (e.g., much smaller)than the FMM used in a conventional deposition method, it is relativelyeasy to manufacture the patterning slit sheet 130. That is, the smallpatterning slit sheet 130 is more suitable in view of the manufacturingprocesses, including etching, and precise elongation, welding,transferring, and washing processes which are performed after theetching, than the FMM used in a conventional deposition method. Inaddition, this is more suitable for manufacturing a relatively largedisplay apparatus (device).

In order to perform deposition while the organic layer depositionassembly 100-1 and the substrate 2 are moved relative to each other asdescribed above, the organic layer deposition assembly 100-1 and thesubstrate 2 may be spaced apart from each other by a certain distance(e.g., a gap). This is described below in more detail.

The deposition source 110 that contains and heats the depositionmaterial 115 is located facing the substrate 2 in the chamber 101. Asthe deposition material 115 contained in the deposition source 110 isvaporized, deposition is performed on the substrate 2.

The deposition source 110 includes a crucible 111 that is filled withthe deposition material 115 and a heater 112 that heats the crucible 111so as to vaporize the deposition material 115 toward a side of thecrucible 111, in particular, toward the deposition source nozzle unit120.

The deposition source nozzle unit 120, in one embodiment, is located ata side of the deposition source 110, for example, a side of thedeposition source 110 toward (or facing) the substrate 2. In thisregard, the organic layer deposition assemblies according to the presentembodiment may each include different deposition nozzles for performingdeposition for forming common layers and pattern layers. That is, adeposition source nozzle unit 120 for forming pattern layers may includea plurality of deposition source nozzles 121 arranged along the Y-axisdirection, that is, a scanning direction of the substrate 2.Accordingly, along the X-axis direction, only one deposition sourcenozzle 121 is formed and thus shadows are substantially reduced. Asource nozzle unit for forming common layers may include a plurality ofdeposition source nozzles 121 arranged along the X-axis direction,whereby a thickness uniformity of the common layers may be improved.

In one embodiment, the patterning slit sheet 130 may be located betweenthe deposition source 110 and the substrate 2. The patterning slit sheet130 may further include a frame having a shape similar to a windowframe. The patterning slit sheet 130 includes a plurality of patterningslits 131 arranged in the X-axis direction. The deposition material 115that has been vaporized in the deposition source 110 passes through thedeposition source nozzle unit 120 and the patterning slit sheet 130 andis then moved toward the substrate 2. In this regard, the patterningslit sheet 130 may be formed using the same method as that used to forman FMM, in particular, a stripe-type mask. For example, the patterningslit sheet 130 may be formed by etching. In this regard, a total numberof patterning slits 131 may be more than a total number of depositionsource nozzles 121.

In one embodiment, the deposition source 110 (and the deposition sourcenozzle unit 120 combined thereto) and the patterning slit sheet 130 maybe spaced apart from each other by a certain distance (e.g., a gap).

As described above, deposition is performed while the organic layerdeposition assembly 100-1 is moved relative to the substrate 2. In orderfor the organic layer deposition assembly 100-1 to be moved relative tothe substrate 2, the patterning slit sheet 130 is spaced apart from thesubstrate 2 by a certain distance (e.g., a gap).

In a conventional deposition method using an FMM, deposition istypically performed with the FMM in close contact with a substrate inorder to prevent formation of shadows on the substrate. However, whenthe FMM is formed in close contact with the substrate, defects due tothe contact between the substrate and the FMM may occur. In addition,because it is difficult to move the mask with respect to the substrate,the mask and the substrate have the same size. Accordingly, the maskbecomes larger as the size of a display device increases. However, it isdifficult to form a large mask.

To address these problems, in the organic layer deposition assembly100-1 according to the present embodiment, the patterning slit sheet 130is formed spaced apart by a certain distance (e.g., a gap) from thesubstrate 2 on which a deposition material is to be deposited.

According to the present embodiment, deposition may be performed while amask formed smaller than a substrate is moved with respect to thesubstrate, and thus, it is relatively easy to manufacture the mask. Inaddition, defects due to contact between the substrate and the mask maybe avoided. In addition, because it is unnecessary to closely contactthe substrate with the mask during a deposition process, a manufacturingspeed may be improved.

Hereinafter, particular dispositions of elements of the upper housing104 will be described.

The deposition source 110 and the deposition source nozzle unit 120 arelocated at a bottom portion of the upper housing 104. Accommodationportions 104-1 are respectively formed on both sides of the depositionunit 100 and the deposition source nozzle unit 120 to have a protrudingshape. The first stage 150, the second stage 160, and the patterningslit sheet 130 are sequentially formed (or located) on the accommodationportions 104-1 in this order.

In this regard, the first stage 150 is formed to move in X-axis andY-axis directions so that the first stage 150 aligns the patterning slitsheet 130 in the X-axis and Y-axis directions. That is, the first stage150 includes a plurality of actuators so that the first stage 150 ismoved in the X-axis and Y-axis directions with respect to the upperhousing 104.

The second stage 160 is formed to move in a Z-axis direction so as toalign the patterning slit sheet 130 in the Z-axis direction. That is,the second stage 160 includes a plurality of actuators so as to move inthe Z-axis direction with respect to the first stage 150.

The patterning slit sheet 130 is located on the second stage 160. Thepatterning slit sheet 130 is located on the first stage 150 and thesecond stage 160 so as to move in the X-axis, Y-axis, and Z-axisdirections, and thus, an alignment, in particular, a real-timealignment, between the substrate 2 and the patterning slit sheet 130,may be performed.

In addition, the upper housing 104, the first stage 150, and the secondstage 160 may guide a flow path of the deposition material 115 such thatthe deposition material 115 discharged through the deposition sourcenozzles 121 is not dispersed outside the flow path. That is, the flowpath of the deposition material 115 is sealed by the upper housing 104,the first stage 150, and the second stage 160, and thus, the movement ofthe deposition material 115 in the X-axis and Y-axis directions may bethereby concurrently or simultaneously guided.

The shielding member 140 may be located between the patterning slitsheet 130 and the deposition source 110. In particular, an anode orcathode pattern is formed on an edge portion of the substrate 2 and isused as a terminal for inspecting a product or in manufacturing aproduct. If an organic material is applied on this edge portion (i.e.,the portion on which the anode or cathode pattern is formed) of thesubstrate 2, the anode or the cathode cannot sufficiently perform itsfunction. Thus, the edge portion of the substrate 2 is formed to be anon-film-forming region on which an organic material or the like is notapplied. As described above, however, in the organic layer depositionapparatus, deposition is performed in a scanning manner while thesubstrate 2 is moved relative to the organic layer deposition apparatus,and thus, it is not easy to prevent the organic material from beingdeposited on the non-film-forming region of the substrate 2.

Therefore, to prevent the organic material from being deposited on thenon-film-forming region of the substrate 2, in the organic layerdeposition apparatus, the shielding member 140 may be located at theedge portion of the substrate 2. Although not particularly illustratedin FIGS. 3 and 4, the shielding member 140 may include two adjacentplates.

When the substrate 2 does not pass through the organic layer depositionassembly 100-1, the shielding member 140 screens the deposition source110, and thus, the deposition material 115 discharged from thedeposition source 110 does not reach the patterning slit sheet 130. Whenthe substrate 2 enters into the organic layer deposition assembly 100-1with the shielding member 140 screening the deposition source 110, afront part of the shielding member 140, which screens the depositionsource 110, moves along with the movement of the substrate 2, and thus,the flow path of the deposition material 115 is opened and thedeposition material 115 discharged from the deposition source 110 passesthrough the patterning slit sheet 130 and is deposited on the substrate2. Also, while the substrate 2 is passing through the organic layerdeposition assembly 100-1, a rear part of the shielding member 140 movesalong with the movement of the substrate 2 to screen the depositionsource 110 so that the flow path of the deposition material 115 isclosed. Accordingly, the deposition material 115 discharged from thedeposition source 110 does not reach the patterning slit sheet 130.

As described above, the non-film-forming region of the substrate 2 isscreened by the shielding member 140, and thus, it is easy (orrelatively easy) to prevent the organic material from being deposited onthe non-film-forming region of the substrate 2 without using a separatestructure.

Hereinafter, the conveyer unit 400 that conveys (or transports) thesubstrate 2, on which the deposition material 115 is to be deposited, isdescribed in more detail. Referring to FIGS. 3 and 4, the conveyer unit400 includes the first conveyer unit 410, the second conveyer unit 420,and the transfer unit 430.

The first conveyer unit 410 conveys (or transports) in an in-line mannerthe transfer unit 430 and the substrate 2 attached to the transfer unit430 so that an organic layer may be formed on the substrate 2 by theorganic layer deposition assembly 100-1, wherein the transfer unit 430includes a carrier 431 and an electrostatic chuck 432 attached thereto.The first conveyer unit 410 includes a coil 411, guide members 412,upper magnetically suspended (e.g., magnetic levitation or magneticallylevitating) bearings (not shown), side magnetically suspended (e.g.,magnetic levitation or magnetically levitating) bearings (not shown),and gap sensors (not shown). In one embodiment, the magnetic levitationbearings and the gap sensors are mounted on the guide members 412.

The second conveyer unit 420 returns to the loading unit 200 thetransfer unit 430 from which the substrate 2 has been separated in theunloading unit 300 after one deposition cycle is completed while thetransfer unit 430 is passing through the deposition unit 100. The secondconveyer unit 420 includes a coil 421, roller guides 422, and a chargingtrack 423.

The transfer unit 430 includes the carrier 431 that is conveyed (ortransported) along the first conveyer unit 410 and the second conveyerunit 420 and the electrostatic chuck 432 that is combined on (orattached to) a surface of the carrier 431. The substrate 2 is attachedto the electrostatic chuck 432.

Hereinafter, each element of the conveyer unit 400 will be described inmore detail.

The carrier 431 of the transfer unit 430 will now be described indetail.

Referring to FIG. 7, the carrier 431 includes a main body part 431 a, amagnetic rail (e.g., a linear motor system (LMS) magnet) 431 b,contactless power supply (CPS) modules 431 c, a power supply unit 431 d,and guide grooves. The carrier 431 may further include cam followers 431f.

The main body part 431 a constitutes a base part of the carrier 431 andmay be formed of a magnetic material, such as iron. In this regard, dueto a repulsive force (and/or an attractive force) between the main bodypart 431 a of the carrier 431 and upper and side magnetically suspendedbearings (e.g., magnetic levitation bearings) 413 and 414, which aredescribed below, the carrier 431 may be maintained spaced apart from theguide members 412 by a certain distance (e.g., a gap).

The guide grooves may be respectively formed at both sides of the mainbody part 431 a and each may accommodate a guide protrusion 412 e of theguide member 412.

The magnetic rail 431 b may be formed along a center line of the mainbody part 431 a in a direction where the main body part 431 a proceeds.The magnetic rail 431 b of the main body part 431 a, and the coil 411,which are described below in more detail, may be combined with eachother to constitute a linear motor, and the carrier 431 may be conveyed(or transported) in an arrow A direction by the linear motor.

The CPS modules 431 c and the power supply unit 431 d may berespectively formed on both sides of the magnetic rail 431 b in the mainbody part 431 a. The power supply unit 431 d includes a battery (e.g., arechargeable battery) that provides power so that the electrostaticchuck 432 can chuck (e.g., fix or hold) the substrate 2 and maintainsoperation. The CPS modules 431 c are wireless charging modules thatcharge the power supply unit 431 d. For example, the charging track 423formed in the second conveyer unit 420, which is described below, isconnected to an inverter (not shown), and thus, when the carrier 431 istransferred into the second conveyer unit 420, a magnetic field isformed between the charging track 423 and the CPS modules 431 c so as tosupply power to the CPS modules 431 c. The power supplied to the CPSmodules 431 c is used to charge the power supply unit 431 d.

The electrostatic chuck 432 may include an electrode embedded in a mainbody formed of ceramic, wherein the electrode is supplied with power.The substrate 2 is attached onto a surface of a main body of theelectrostatic chuck 432 as a high voltage (e.g., a suitable voltage or arelatively high voltage) is applied to the electrode.

Hereinafter, the transfer unit 430 is described in detail.

The magnetic rail 431 b of the main body part 431 a and the coil 411 maybe combined with each other to constitute an operation unit. In thisregard, the operation unit may be a linear motor. The linear motor has ahigh degree (e.g., very high degree) of position determination due toits small frictional coefficient and little position error, as comparedto a conventional slide guide system. As described above, the linearmotor may include the coil 411 and the magnetic rail 431 b. The magneticrail 431 b is linearly located on the carrier 431, and a plurality ofthe coils 411 may be located at an inner side of the chamber 101 andseparated from the magnetic rail 431 b by a certain distance (e.g., agap) so as to face the magnetic rail 431 b. Because the magnetic rail431 b is located at the carrier 431 instead of the coil 411, the carrier431 may be operable without power being supplied thereto. In thisregard, the coil 411 may be formed (or located) in an atmosphere (ATM)box in an air atmosphere, and the carrier 431 to which the magnetic rail431 b is attached may be moved in the chamber 101 maintained in vacuum.

Hereinafter, the first conveyer unit 410 and the transfer unit 430 aredescribed in detail.

Referring to FIGS. 4 and 7, the first conveyer unit 410 conveys (ortransports) the electrostatic chuck 432 that fixes (or attaches to) thesubstrate 2 and the carrier 431 that conveys (or transports) theelectrostatic chuck 432. In this regard, the first conveyer unit 410includes the coil 411, the guide members 412, the upper magneticallysuspended (e.g., magnetic levitation) bearings 413, the sidemagnetically suspended (e.g., magnetic levitation) bearings 414, and thegap sensors 415 and 416.

The coil 411 and the guide members 412 are formed (or located) insidethe upper housing 104. The coil 411 is formed (or located) in an upperportion of the upper housing 104, and the guide members 412 arerespectively formed on (or located at) both inner sides of the upperhousing 104.

The guide members 412 guide the carrier 431 to move in a direction. Inthis regard, the guide members 412 are formed to pass through thedeposition unit 100.

In particular, the guide members 412 accommodate both sides of thecarrier 431 to guide the carrier 431 to move along in the direction ofarrow A illustrated in FIG. 3. In this regard, the guide member 412 mayinclude a first accommodation part 412 a disposed below the carrier 431,a second accommodation part 412 b disposed above the carrier 431, and aconnection part 412 c that connects the first accommodation part 412 aand the second accommodation part 412 b. An accommodation groove 412 dis formed by the first accommodation part 412 a, the secondaccommodation part 412 b, and the connection part 412 c. Both sides ofthe carrier 431 are respectively accommodated in the accommodationgrooves 412 d, and the carrier 431 is moved along the accommodationgrooves 412 d.

The side magnetically suspended (e.g., magnetic levitation) bearings 414are each located at (or in) the connection part 412 c of the guidemember 412 so as to respectively correspond to both sides of the carrier431. The side magnetically suspended (e.g., magnetic levitation)bearings 414 form (or cause) a distance between the carrier 431 and theguide member 412 so that the carrier 431 is moved along the guidemembers 412 in non-contact with the guide members 412. That is, arepulsive force R1 occurring between the side magnetically suspended(e.g., magnetic levitation) bearing 414 on the left side of FIG. 7 andthe carrier 431, which is a magnetic material, and a repulsive force R2occurring between the side magnetically suspended (e.g., magneticlevitation) bearing 414 on the right side in FIG. 7 and the carrier 431,which is a magnetic material, maintain equilibrium, and thus, there is aconstant (or substantially constant) distance between the carrier 431and the respective parts of the guide member 412.

Each upper magnetically suspended (e.g., magnetic levitation) bearing413 may be located at (or in) the second accommodation part 412 b of theguide member 412 so as to be above the carrier 431. The uppermagnetically suspended (e.g., magnetic levitation) bearings 413 enablethe carrier 431 to be moved along the guide members 412 in non-contactwith the first and second accommodation parts 412 a and 412 b and with adistance (or a gap) therebetween maintained constant (or substantiallyconstant). That is, a repulsive force (or alternatively an attractiveforce) R3 occurring between the upper magnetically suspended bearing 413and the carrier 431, which is a magnetic material, and gravity Gmaintain equilibrium, and thus, there is a constant (or substantiallyconstant) distance between the carrier 431 and the respective guidemembers 412.

Each guide member 412 may further include gap sensors 415 and 416. Thegap sensors 415 and 416 may measure a distance between the carrier 431and the guide member 412. Referring to FIG. 7, the gap sensor 415 may bedisposed in the first accommodation part 412 a so as to correspond to abottom portion of the carrier 431. The gap sensor 415 disposed in thefirst accommodation part 412 a may measure a distance between the firstaccommodation part 412 a and the carrier 431. The gap sensor 416 may bedisposed at a side of the side magnetically suspended bearing 414. Thegap sensor 416 may measure a distance between a side surface of thecarrier 431 and the side magnetically suspended bearing 414. The presentinvention is not limited to the above example and the gap sensor 416 maybe disposed in the connection part 412 c.

Magnetic forces of the upper and side magnetically suspended (e.g.,magnetic levitation) bearings 413 and 414 may vary according to valuesmeasured by the gap sensors 415 and 416, and thus, distances between thecarrier 431 and the respective guide members 412 may be adjusted in realtime. That is, a precise transfer of the carrier 431 may be feedbackcontrolled using the upper and side magnetically suspended (e.g.,magnetic levitation) bearings 413 and 414 and the gap sensors 415 and416.

Hereinafter, the second conveyer unit 420 and the transfer unit 430 aredescribed in detail.

Referring back to FIG. 4, the second conveyer unit 420 returns theelectrostatic chuck 432 from which the substrate 2 has been separated inthe unloading unit 300 and the carrier 431 that carries theelectrostatic chuck 432 to the loading unit 200. In this regard, thesecond conveyer unit 420 includes the coil 421, the roller guides 422,and the charging track 423.

In particular, the coil 421, the roller guides 422, and the chargingtrack 423 may be positioned at an inner surface of the lower housing103. For example, the coil 421 and the charging track 423 may be locatedat a top inner surface of the lower housing 103, and the roller guides422 may be located at both inner sides of the lower housing 103. In thisregard, like the coil 411 of the first conveyer unit 410, the coil 421may be located in an ATM box.

Also, like the first conveyer unit 410, the second conveyer unit 420also includes the coil 421, and the coil 421 may be combined with themagnetic rail 431 b of the main body part 431 a of the carrier 431 toconstitute a driving unit, and herein the driving unit may be a linearmotor. The carrier 431 may be moved by the linear motor along adirection opposite to the direction of arrow A illustrated in FIG. 3.

The roller guides 422 guide the carrier 431 to move in a direction. Inthis regard, the roller guides 422 are formed (e.g., located orarranged) to pass through the deposition unit 100. In particular, theroller guides 422 support cam followers 431 f (see FIG. 7) respectivelyformed on both sides of the carrier 431 to guide the carrier 431 to movealong a direction opposite to the direction of arrow A illustrated inFIG. 3. That is, the carrier 431 is moved with the cam followers 431 fdisposed on both sides of the carrier 431 respectively rotating alongthe roller guides 422. In this regard, the cam followers 431 f areutilized as bearings used to accurately repeat a particular operation.In an embodiment, a plurality of the cam followers 431 f are formed on aside surface of the carrier 431 and serve as a wheel for conveying thecarrier 431 in the second conveyer unit 420. A detailed description ofthe cam followers 431 f is not provided herein.

The second conveyer unit 420 is used in a process of returning thecarrier 431 from which the substrate 2 has been separated and not in aprocess of depositing an organic material on the substrate 2, and thus,position accuracy (or positional accuracy) thereof is not as needed asby the first conveyer unit 410. Therefore, magnetic suspension (e.g.,magnetic levitation) is applied to the first conveyer unit 410 thatrequires high position accuracy to thereby obtain position accuracy, anda conventional roller method is applied to the second conveyer unit 420that requires relatively low position accuracy, thereby reducingmanufacturing costs and simplifying a structure of an organic layerdeposition apparatus. Although not illustrated in FIG. 4, the magneticsuspension may also be applied to the second conveyer unit 420, as inthe first conveyer unit 410.

The organic layer deposition assembly 100-1 of the organic layerdeposition apparatus 1 according to the present embodiment may furtherinclude cameras 170 and sensors 180 for an aligning process. In detail,the cameras 170 may align in real time a first alignment mark formed inthe frame 135 of the patterning slit sheet 130 and a second alignmentmark formed on the substrate 2. In this regard, the cameras 170 arepositioned for a more accurate view in the chamber 101 maintained invacuum during deposition. For this, the cameras 170 may be installed inrespective camera accommodation units 171 in an atmospheric state.

Because the substrate 2 and the patterning slit sheet 130 are spacedapart from each other by a certain distance (e.g., a gap), distancesbetween the substrate 2 and the patterning slit sheet 130 that arelocated at different positions are measured using the cameras 170. Forthis operation, the organic layer deposition assembly 100-1 of theorganic layer deposition apparatus 1 may include the sensors 180. Inthis regard, the sensors 180 may be confocal sensors. The confocalsensors may scan an object to be measured by using laser beams thatrotate at a high speed by using a scanning mirror and measure a distanceto the object by using fluorescent or reflected rays emitted by thelaser beams. The confocal sensors may measure a distance by sensing aboundary interface between different media.

The use of the cameras 170 and the sensors 180 enables real-timemeasuring of a distance between the substrate 2 and the patterning slitsheet 130 and thus aligning the substrate 2 and the patterning slitsheet 130 in real-time, and thus position accuracy (or positionalaccuracy) of a pattern may be improved (e.g., significantly improved).

FIG. 5 is a perspective view illustrating deposition source nozzles 121for forming pattern layers, and FIG. 6 is a perspective viewillustrating deposition source nozzles 121′ for forming common layers.Organic layer deposition assemblies for forming pattern layers arepattern layer deposition assemblies (for example, see organic layerdeposition assemblies 100-5 to 100-9 of FIG. 13) and thus will bereferred to as such hereinafter, and organic layer deposition assembliesfor forming common layers are common layer deposition assemblies 100-1to 100-4, 100-10, and 100-11 and thus will be referred to as suchhereinafter.

Referring to FIG. 5, the pattern layer deposition assembly 100-5includes three deposition sources 110 and three deposition source nozzleunits 120, and each of the deposition source nozzle units 120 includesone deposition source nozzle 121 at its center. The deposition material115 that has been vaporized in the deposition source 110 passes throughthe deposition source nozzle unit 120 and is then moved toward thesubstrate 2. As described above, each deposition source nozzle unit 120has one deposition source nozzle 121, and in a single pattern layerdeposition assembly 100-5 according to one embodiment, three depositionsources 110 are arranged along a scan direction of the substrate 2, andultimately, a plurality of deposition source nozzles 121 are arrangedalong the scan direction of the substrate 2 in the pattern layerdeposition assembly 100-5. In this regard, if a plurality of thedeposition source nozzles 121 are arranged along the X-axis direction,an interval between each of the deposition source nozzles 121 and thepatterning slit 131 may vary and in this case, a shadow may be formed bya deposition material ejected from a deposition source nozzle that islocated relatively far from the patterning slit 131. Accordingly,forming only one deposition source nozzle 121 in the X-axis direction asin the present embodiment may contribute to a reduction (e.g.,substantial decrease or reduction) in the formation of shadows. Inaddition, because the deposition source nozzles 121 are arranged alongthe scan direction, even when a flux difference occurs betweenindividual deposition source nozzles, the flux difference may be offsetand thus deposition uniformity may be maintained constant (orsubstantially constant).

In addition, although not illustrated in FIG. 5, among three depositionsources 110 located in the pattern layer deposition assembly 100-5,deposition sources at opposite ends may be used to deposit a hostmaterial and the middle deposition source may be used to deposit adopant material. As described above, an organic layer depositionapparatus according to an embodiment of the present invention mayinclude both a deposition source for depositing a host material and adeposition source for depositing a dopant material so as to concurrentlydeposit a host material and a dopant material on the substrate 2, andthus a process is quickly performed and device efficiency may also beimproved.

Referring to FIG. 6, a deposition source nozzle unit 120′ is located ata side of a deposition source 110′, for example, a side of thedeposition source 110′ facing the substrate 2. In addition, thedeposition source nozzle unit 120′ includes a plurality of depositionsource nozzles 121′ arranged along the X-axis direction (that is, adirection perpendicular to the scan direction of the substrate 2). Inone embodiment, the deposition source nozzles 121′ may be formedequidistant from each other, and according to another embodiment,distances between adjacent deposition source nozzles 121′ may decreasetoward opposite ends of the deposition source nozzle unit 120′. Adeposition material vaporized in the deposition source 110′ may passthrough the deposition source nozzles 121′ of the deposition sourcenozzle unit 120′ to move toward the substrate 2 on which the depositionmaterial is to be deposited. As described above, in forming a commonlayer, the deposition source nozzles 121′ are formed along the X-axisdirection (that is, a direction perpendicular to the scan direction ofthe substrate 2), and thus a thickness uniformity of common layers maybe improved.

In one embodiment, the patterning slit sheet 130 may be located betweenthe deposition source 110 and the substrate 2. The patterning slit sheet130 may further include a frame having a shape similar to a windowframe. The patterning slit sheet 130 includes the plurality ofpatterning slits 131 arranged along the X-axis direction. The depositionmaterial 115 that has been vaporized in the deposition source 110 passesthrough the deposition source nozzle unit 120 and the patterning slitsheet 130 and is then moved toward the substrate 2. In this regard, thepatterning slit sheet 130 may be formed using the same method as thatused to form an FMM, in particular, a stripe-type mask. For example, thepatterning slit sheet 130 may be formed by etching. For example, a totalnumber of patterning slits 131 may be more than a total number ofdeposition source nozzles 121.

In one embodiment, the deposition source 110 and the deposition sourcenozzle unit 120 combined thereto may be spaced apart from the patterningslit sheet 130 by a certain distance (e.g., a gap).

As described above, deposition is performed while the organic layerdeposition assembly 100-1 is moved relative to the substrate 2. In orderfor the organic layer deposition assembly 100-1 to be moved relative tothe substrate 2, the patterning slit sheet 130 is located spaced apartfrom the substrate 2 by a certain distance (e.g., a gap).

In a conventional deposition method using an FMM, deposition istypically performed with the FMM in close contact with a substrate inorder to prevent formation of shadows on the substrate. However, whenthe FMM is formed in close contact with the substrate, defects due tothe contact between the substrate and the FMM may occur. In addition,because it is difficult to move the mask with respect to the substrate,the mask and the substrate have the same size. Accordingly, the maskbecomes larger as the size of a display device increases. However, it isdifficult to form a large mask.

To address these problems, in the organic layer deposition assembly100-1 according to the present embodiment, the patterning slit sheet 130is formed spaced apart by a certain distance (e.g., a gap) from thesubstrate 2 on which a deposition material is to be deposited.

According to the present embodiment, deposition may be performed while amask formed smaller than a substrate is moved with respect to thesubstrate, and thus, it is relatively easy to manufacture the mask. Inaddition, defects due to contact between the substrate and the mask maybe avoided. In addition, because it is unnecessary to closely contactthe substrate with the mask during a deposition process, a manufacturingspeed may be improved.

In one embodiment, referring to FIG. 4, the camera 170 may align a firstmark formed on the frame 135 of the patterning slit sheet 130 and asecond mark (not shown) formed on the substrate 2 in real-time. Thesensor 180 may be a confocal sensor. As described above, since adistance between the substrate 2 and the patterning slit sheet 130 ismeasurable in real time using the camera 170 and the sensor 180, thesubstrate 2 may be aligned with the patterning slit sheet 130 in realtime, whereby position accuracy of a pattern may be significantlyimproved.

The organic layer deposition assemblies 100-1 of the apparatus 1 fororganic material deposition according to an embodiment of the presentinvention may further include a specially designed shielding member 140,i.e., a tooling shutter 140′ (see FIG. 9) for controlling the thicknessof an organic material layer formed on the substrate 2. Detaileddescription thereof is given below.

In more detail, characteristics of an organic light-emitting devicelargely depend on the thickness of an organic material layer. Therefore,to manufacture an organic light-emitting display apparatus withexcellent quality, a tooling operation for correcting thicknesses of allorganic material layers before forming the organic material layers isrequired. Here, the tooling operation refers to an operation fordepositing an organic material to a desired thickness by depositing theorganic material to a substrate having no devices deposited thereon(e.g., a TFT) at a set or predetermined deposition rate, measuring thethickness of the deposited organic material by using an analyzing devicefor measuring thickness, such as an ellipsometer, and changing a toolingfactor (T/F) of the organic material or adjusting the deposition ratebased on the measured thickness. Here, the T/F refers to controlparameters in a tooling operation based on a ratio between a thicknessof an organic material layer actually measured by a sensor and a targetthickness of the organic material layer.

However, if a tooling operation is performed on an organic materiallayer to be formed on a substrate using the method in the related art,it is necessary to perform a tooling operation for each organic materiallayer to be formed, each deposition source, or each assembly. In otherwords, it is necessary to perform a tooling operation for each of theorganic materials on a one-by-one basis, and thus a significant periodof time is taken therefor. For example, in the case of the apparatus fororganic layer deposition shown in FIG. 1, in total, there are elevenorganic layer deposition assemblies that are arranged and each of theorganic layer deposition assemblies includes three deposition sources.It is necessary to perform 33 tooling operations in total on all of thedeposition sources. Furthermore, since it is necessary to form organicmaterial layers on glass substrates and analyze the same, it isnecessary to invest in materials for deposition and analyzing devicesfor the tooling operation. Therefore, the method of performing toolingoperations in the related art deteriorates production efficiency andraises material costs and investment costs.

To resolve these problems, the apparatus for organic layer depositionfurther includes the tooling shutter 140′ to control thicknesses oforganic material layers formed on the substrate 2, wherein a pluralityof organic material layers are formed on a single substrate and atooling operation is performed on a plurality of deposition sources atonce.

FIG. 8 is a schematic perspective view of the tooling shutter 140′ whilethe deposition unit 100 of FIG. 3 is depositing an organic materiallayer, and FIG. 9 is a schematic perspective view showing the toolingshutter 140′ while the deposition unit 100 is in a tooling operation.

FIGS. 8 and 9 show three organic layer deposition assemblies, assumingthat the first organic layer deposition assembly 100-1 and the thirdorganic layer deposition assembly 100-3 are organic layer depositionassemblies for depositing a common layer and the second organic layerdeposition assembly 100-2 is an organic layer deposition assembly fordepositing a pattern layer.

In this case, the first organic layer deposition assembly 100-1 and thethird organic layer deposition assembly 100-3 for depositing a commonlayer respectively include first tooling shutters 141. A plurality oftooling slits 141 a may be formed in the first tooling shutter 141 tohave a long shape extending in a direction in which a substrate moves.An average of thicknesses of a plurality of organic material layersformed on a substrate is obtained by using the plurality of toolingslits 141 a, and a tooling operation for correcting thicknesses of theorganic material layers is performed based on the average.

The first tooling shutters 141 are formed to be able to move in organiclayer deposition assemblies, and the first tooling shutters 141 may bearranged in front of the deposition sources 110 only when a toolingoperation is performed. In other words, during deposition of an organicmaterial layer, as shown in FIG. 8, as the first tooling shutters 141are a set or predetermined distance apart from the deposition sources110 in a direction, a path in which the deposition material 115 moves isformed, and thus the deposition material 115 emitted by the depositionsource 110 is deposited on the substrate 2. During a tooling operation,as shown in FIG. 9, the first tooling shutters 141 are arranged in frontof the deposition sources 110, and thus organic materials evaporated atthe deposition sources 110 pass through the first tooling shutters 141and form a set or predetermined pattern layer on the substrate 2.

Here, the tooling slits 141 a of the first tooling shutter 141 arrangedin each of the organic layer deposition assemblies may be formed to besomewhat offset to one another. In other words, the tooling slits 141 aof the first organic layer deposition assembly 100-1 may not be arrangedon the same lines as the tooling slits 141 a of the third organic layerdeposition assembly 100-3, and thus an organic material evaporated atthe first organic layer deposition assembly 100-1 and an organicmaterial evaporated at the third organic layer deposition assembly 100-3may be deposited at different regions on a substrate.

The second organic layer deposition assembly 100-2 for deposition of apattern layer includes a second tooling shutter 142. Tooling slits 142 afor measuring thicknesses of organic material layers may be arranged attwo opposite ends of the second tooling shutter 142 to have a long shapeextending in a direction in which a substrate moves.

As described above, an average of thicknesses of a plurality of patternlayers formed on a substrate is obtained by using the tooling slits 142a formed at two opposite ends of the second tooling shutter 142, and atooling operation for correcting thicknesses of the organic materiallayers is performed based on the average.

The second tooling shutter 142 is formed to be able to move in theorganic layer deposition assembly and the second tooling shutter 142 maybe arranged in front of the deposition source 110 only when a toolingoperation is performed. In other words, during deposition of an organicmaterial layer, as shown in FIG. 8, as the second tooling shutter 142 isa set or predetermined distance apart from the deposition source 110 ina direction, a path in which the deposition material 115 moves isformed, and thus the deposition material 115 emitted by the depositionsource 110 is deposited on the substrate 2. During a tooling operation,as shown in FIG. 9, the second tooling shutter 142 is arranged in frontof the deposition source 110, and thus organic materials evaporated atthe deposition source 110 pass through the second tooling shutter 142and form a set or predetermined pattern layer on the substrate 2.

Here, the width of the tooling slit 142 a of the second tooling shutter142 may be greater than the width of the patterning slit 131 of thepatterning slit sheet 130. Although the width of the patterning slit 131of the patterning slit sheet 130 is about several hundred μm and issimilar to the thickness of a pattern layer, the minimum measurablethickness of a pattern layer is about 2 mm, and thus it is necessary toform the tooling slit 142 a of the second tooling shutter 142 for atooling operation to have a width greater than that of the patterningslit 131 of the patterning slit sheet 130.

As described above, by forming a plurality of linear pattern layers on asingle substrate, a plurality of organic material layers are formed onthe single substrate and a tooling operation may be performed withrespect to a plurality of deposition sources at the same time.

Hereinafter, a method by which the apparatus for organic layerdeposition corrects thickness will be described in more detail.

FIG. 10 is a schematic view showing that, during the tooling operationof FIG. 9, an organic material layer is formed as a substrate passesthrough the first organic layer deposition assembly 100-1. FIG. 11 is aschematic view showing that, during the tooling operation of FIG. 9, anorganic material layer is formed as the substrate passes through thesecond organic layer deposition assembly 100-2. FIG. 12 is a schematicview showing that, during the tooling operation of FIG. 9, an organicmaterial layer is formed as the substrate passes through the thirdorganic layer deposition assembly 100-3.

A comparable method of correcting thickness will be described below.First, organic material films are formed by depositing organic materialsfor film formation on respective deposition glass substrates by using anarbitrary T/F and an arbitrary deposition rate. Next, thicknesses of theorganic material films are measured by using an analyzing device formeasuring thickness, such as an ellipsometer. Target thicknesses arefulfilled by adjusting the T/F based on the measured thicknesses. Next,to determine whether the corrected T/F is accurate, it is necessary toperform tooling operations on the respective organic materials again,and, even after the formation of the organic material films, it isnecessary to perform tooling operations once more in every 100 to 120depositions.

However, by using the method of correcting thicknesses according to anembodiment of the present invention, films are formed by using a singlesubstrate in a single pass instead of forming films with respect to eachof the deposition sources. In other words, when the tooling shutters140′ are arranged as shown in FIG. 9 and the substrate 2 moves in thedirection of arrow A in a tooling operation, deposition materialsaccommodated in the first organic layer deposition assembly 100-1 arepatterned onto the substrate 2 as the substrate 2 passes through thefirst organic layer deposition assembly 100-1, and thus a first toolingpattern layer 2 a is formed on the substrate 2, as shown in FIG. 10.Here, the first tooling pattern layer 2 a is patterned by the toolingshutter 140′ of the first organic layer deposition assembly 100-1.

Here, the substrate 2 continues to move and, when the substrate 2 passesthrough the second organic layer deposition assembly 100-2, depositionmaterials accommodated in the second organic layer deposition assembly100-2 are patterned onto the substrate 2, and thus a second toolingpattern layer 2 b is formed on the substrate 2, as shown in FIG. 11. Thesecond tooling pattern layer 2 b is patterned by patterning slits 131 bof the patterning slit sheet 130 of the second organic layer depositionassembly 100-2.

Here, the substrate 2 continues to move and, when the substrate 2 passesthrough the third organic layer deposition assembly 100-3, depositionmaterials accommodated in the third organic layer deposition assembly100-3 are patterned onto the substrate 2, and thus a third toolingpattern layer 2 c is formed on the substrate 2, as shown in FIG. 12. Thethird tooling pattern layer 2 c is patterned by the tooling shutters140′ of the third organic layer deposition assembly 100-3.

As described above, according to an embodiment of the present invention,a tooling operation is performed by using a single substrate in a singlepass without forming films on different substrates according torespective deposition sources, and a period of time may be reduced ascompared to a case in which thicknesses of films are measured at each ofthe substrates, and thus productivity may be improved. Furthermore, aunit price of a product may be reduced due to a reduction of investmentbased on a reduction of substrate costs and the reduced number ofanalyzing devices. Therefore, mass production may be significantlyimproved.

FIG. 13 is a schematic perspective view of deposition assembliesincluding deposition sources, according to an embodiment of the presentinvention. Referring to FIG. 13, an organic layer deposition apparatusaccording to an embodiment of the present invention includes elevenorganic layer deposition assemblies 100-1, 100-2 through 100-11. Inaddition, each of the deposition assemblies 100-1, 100-2 through 100-11includes three deposition sources. For example, the deposition assembly100-1 may include three deposition sources 110-1 a, 110-1 b, and 110-1c, and the deposition assembly 100-2 may include three deposition source110-2 a, 110-2 b, and 110-2 c.

The organic layer deposition assemblies 100-1, 100-2 through 100-11include, as described above, the common layer deposition assemblies100-1, 100-2, 100-3, 100-4, 100-10, and 100-11 and the pattern layerdeposition assemblies 100-5 through 100-9.

The common layer deposition assemblies 100-1, 100-2, 100-3, 100-4,100-10, and 100-11 may form common layers of an organic layer (forexample, see OLED of FIG. 26. That is, the deposition sources 110-1 a,110-1 b, and 110-1 c of the common layer deposition assembly 100-1 mayinclude a deposition material for forming a hole injection layer, anddeposition sources 110-2 a, 110-2 b, and 110-2 c of the common layerdeposition assembly 100-2 may include a deposition material for formingan intermediate layer, deposition sources 110-3 a, 110-3 b, and 110-3 cof the common layer deposition assembly 100-3 may include a depositionmaterial for forming a hole transport layer, and deposition sources110-4 a, 110-4 b, and 110-4 c of the common layer deposition assembly100-4 may include a deposition material for forming a hole injectionlayer. In addition, deposition sources 110-10 a, 110-10 b, and 110-10 cof the common layer deposition assembly 100-10 may include a depositionmaterial for forming an electron transport layer, and deposition sources110-11 a, 110-11 b, and 110-11 c of the common layer deposition assembly100-11 may include a deposition material for forming an electroninjection layer. The deposited layers formed by the common layerdeposition assemblies 100-1, 100-2, 100-3, 100-4, 100-10, and 100-11 maybe commonly formed regardless of sub-pixels. Accordingly, a patterningslit sheet, that is, an open mask 136 that has one patterning slit, maybe formed on (e.g., located on or above) deposition sources of thecommon layer deposition assemblies 100-1, 100-2, 100-3, 100-4, 100-10,and 100-11.

Each of the pattern layer deposition assemblies 100-5, 100-6, 100-7,100-8, and 100-9 may form a patterned layer of the organic layer 62 fora corresponding sub-pixel. That is, deposition sources 110-5 a, 110-5 b,and 110-5 c of the pattern layer deposition assembly 100-5 may include adeposition material for forming an auxiliary layer of red and greensub-pixels, deposition sources 110-6 a, 110-6 b, and 110-6 c of thepattern layer deposition assembly 100-6 may include a depositionmaterial forming an auxiliary layer for a red sub-pixel, depositionsources 110-7 a, 110-7 b, and 110-7 c of the pattern layer depositionassembly 100-7 may include a deposition material for forming a redemission layer, deposition sources 110-8 a, 110-8 b, and 110-8 c of thepattern layer deposition assembly 100-8 may include a depositionmaterial for forming a green emission layer, and deposition sources110-9 a, 110-9 b, and 110-9 c of the pattern layer deposition assembly100-9 may include a deposition material for forming a blue emissionlayer.

The patterning slit sheet 130 having the patterning slits 131 may belocated over deposition sources of the pattern layer depositionassemblies 100-5, 100-6, 100-7, 100-8, and 100-9.

The present invention is not limited thereto, and an organic layerdeposition apparatus according to other embodiments of the presentinvention may include two or more deposition assemblies, and each of thedeposition assemblies may include one or more deposition sources. Inaddition, a deposition material included in a deposition source may varyaccording to the structure of a device.

FIG. 14 is a schematic plan view of examples of correction slit sheets.When thicknesses of patterning layers are measured, correction slitsheets 231, 232, 233, 234, and 235 replace a patterning slit sheet (forexample, see 130 of FIG. 4) of each pattern layer deposition assembly(for example, see 100-5, 100-6, 100-7, 100-8, and 100-9 of FIG. 137) tobe located on a second stage (for example, see 160 of FIG. 4). That is,the correction slit sheets 231, 232, 233, 234, and 235 may be located onthe respective second stages 160 of pattern layer deposition assemblies(see 100-5, 100-6, 100-7, 100-8, and 100-9 of FIG. 13).

Each of the correction slit sheets 231, 232, 233, 234, and 235 mayrespectively include (or have) a plurality of correction slits 231 a,232 a, 233 a, 234 a, and 235 a. A lengthwise direction of each of thecorrection slits 231 a, 232 a, 233 a, 234 a, and 235 a may be parallelto the conveying (or transporting) direction of the substrate 2, thatis, a first direction A, and locations of the correction slits 231 a,232 a, 233 a, 234 a, and 235 a along a second direction perpendicular tothe first direction A are different from each other. That is, thecorrection slits 231 a, 232 a, 233 a, 234 a, and 235 a may be formedsuch that they are offset in the second direction perpendicular to thefirst direction A. That is, locations of the correction slits 231 a, 232a, 233 a, 234 a, and 235 a of the correction slit sheets 231, 232, 233,234, and 235 located on the pattern layer deposition assemblies 100-5,100-6, 100-7, 100-8, and 100-9 may be different from each other withrespect to the first direction A. Accordingly, when deposition materialsthat have passed through the correction slits 231 a, 232 a, 233 a, 234a, and 235 a are deposited on the substrate 2 to form pattern layers,the formed pattern layers do not overlap.

When thicknesses of pattern layers are measured, among depositionsources of the pattern layer deposition assemblies 100-5, 100-6, 100-7,100-8, and 100-9, deposition sources 110-5 a, 110-6 a, 110-7 a, 110-8 a,and 110-9 a are operated, and operations of the other deposition sources110-5 b, 110-5 c. 110-6 b, 110-7 b, 110-7 c, 110-8 b, 110-8 c, 110-9 b,and 110-9 c are stopped, or shutters (not shown in FIG. 14) are used toprevent their deposition materials from reaching correction substrates,and in this state, a first correction substrate is conveyed (e.g.,transported) in the first direction A and deposition materials of theoperated deposition sources 110-5 a, 110-6 a, 110-7 a, 110-8 a, and110-9 a are allowed to be deposited on the first correction substrate.When the first correction substrate has completely passed through thedeposition units, deposition sources 110-5 b, 110-6 b, 110-7 b, 110-8 b,and 110-9 b are operated, and while deposition materials of depositionsources other than the deposition sources 110-5 b, 110-6 b, 110-7 b,110-8 b, 110-9 b are prevented from reaching the second correctionsubstrate, the second correction substrate is conveyed (or transported)in the first direction A to allow deposition materials ejected fromdeposition sources to be deposited on the second correction substrate.When the second correction substrate has completely passed through thedeposition units, deposition sources 110-5 c, 110-6 c, 110-7 c, 110-8 c,and 110-9 c are operated, and while deposition materials of depositionsources other than the deposition sources 110-5 c, 110-6 c, 110-7 c,110-8 c, and 110-9 c are prevented from reaching the second correctionsubstrate, the third correction substrate is conveyed (or transported)in the first direction A to allow deposition materials ejected fromdeposition sources to be deposited on the third correction substrate.

As described above, when a deposition process is performed to measurethicknesses of pattern layers by using the correction slit sheets 231,232, 233, 234, and 235, the number of correction substrates used tomeasure a thickness of a pattern layer may be the same as the number ofdeposition sources included in a pattern layer deposition assembly. Forexample, because each of the pattern layer deposition assemblies 100-5,100-6, 100-7, 100-8, and 100-9 includes, as illustrated in FIG. 7, threedeposition sources, three correction substrates are used to measurethicknesses of pattern layers of the deposition sources 110-5 a, 110-5b, 110-5 c, . . . , 110-9 a, 110-9 b, and 110-9 c.

For example, the use of the correction slit sheets 231, 232, 233, 234,and 235 enable thicknesses of pattern layers formed by using depositionsources to be measured with three correction substrates. That is, whenthe correction slit sheets 231, 232, 233, 234, and 235 having thecorrection slits 231 a, 232 a, 233 a, 234 a, and 235 a that are offsetfrom each other are not used, a total of 15 correction substrates, whichis the same number as the number of deposition sources 110-5 a, 110-5 b,110-5 c, . . . , 110-9 a, 110-9 b, 110-9 c, may be required to measurethicknesses of pattern layers formed by using deposition sources.However, because the correction slit sheets 231, 232, 233, 234, and 235according to an embodiment of the present invention include thecorrection slits 231 a, 232 a, 233 a, 234 a, and 235 a that are offsetfrom each other, pattern layers formed by deposition sources of thepattern layer deposition assemblies 100-5, 100-6, 100-7, 100-8, and100-9 do not overlap. Accordingly, when the number of correctionsubstrates is the same as the number (three in the embodimentillustrated in FIG. 13) of deposition sources of the pattern layerdeposition assemblies 100-5, 100-6, 100-7, 100-8, and 100-9, thicknessesof pattern layers formed by deposition sources of the pattern layerdeposition assemblies 100-5, 100-6, 100-7, 100-8, and 100-9 may bemeasured. By doing so, time and costs for the measurement and correctionof thicknesses of pattern layers may be reduced.

Lengths of the correction slits 231 a, 232 a, 233 a, 234 a, and 235 amay all be the same in the embodiment illustrated in FIG. 14.

FIG. 15 is a schematic plan view of other examples of correction slitsheets.

Correction plates 231 b, 232 b, 233 b, 234 b, and 235 b are respectivelylocated or positioned on surfaces of the correction slit sheets 331,332, 333, 334, and 335 to block at least a portion of a depositionmaterial ejected from each deposition source.

The correction plates 231 b, 232 b, 233 b, 234 b, and 235 b are shapedsuch that the height (or width) of the correction plates is maximum at alocation near the respective centers of the correction slit sheets 331,332, 333, 334, and 335, and the height (or width) decreases asrespective portions of the correction plates approach edges of therespective correction slit sheets. In other words, a gap between eachpair of the correction plates 231 b, 232 b, 233 b, 234 b, and 235 b isat a minimum at a location near central portions of the respectivecorrection slit sheets 331, 332, 333, 334, and 335, and the gap betweenthe pair of the correction plates becomes wider as portions of thecorrection plates 231 b, 232 b, 233 b, 234 b, and 235 b approachrespective end portions of the correction slit sheets 331, 332, 333,334, and 335. As illustrated in FIG. 15, the correction plates 231 b,232 b, 233 b, 234 b, and 235 b may have a shape of a circular arc orcosine.

The correction plates 231 b, 232 b, 233 b, 234 b, and 235 b having sucha shape may result in a greater amount of shield deposition material atthe center of a correction slit sheet than at an end of the correctionslit sheet.

According to another embodiment of the present invention, instead ofblocking a deposition material by using the correction plates 231 b, 232b, 233 b, 234 b, and 235 b, correction slits of a correction slit sheetmay be formed to have different lengths to block a deposition material.That is, correction slits of each correction slit sheet may have greaterlengths away from the center of the correction slit sheet.

FIG. 16 is a schematic perspective view of deposition assemblies eachincluding a deposition unit, according to an embodiment of the presentinvention. Referring to FIG. 16, an organic layer deposition apparatusaccording to an embodiment of the present invention may include 11deposition assemblies 100-1 through 100-11. Also, each of the depositionassemblies 100-1 through 100-11 may include three deposition sources.For example, the deposition assembly 100-1 includes three depositionsources 110-1 a through 110-1 c, and the deposition assembly 100-2 mayinclude three deposition sources 110-2 a through 110-2 c.

Each of the deposition assemblies 100-1 through 100-4, 100-10 and 100-11may form a common layer in an organic layer 62 of FIG. 26. In otherwords, the deposition sources 110-1 a through 110-1 c of the depositionassembly 100-1 may include a deposition material for forming a holeinjection layer, the deposition sources 110-2 a through 110-2 c of thedeposition assembly 100-2 may include a deposition material for formingan injection layer, deposition sources 110-3 a through 110-3 c of thedeposition assembly 100-3 may include a deposition material for forminga hole transport layer, and deposition sources 110-4 a through 110-4 cof the deposition assembly 100-4 may include a deposition material forforming a hole injection layer. Also, deposition sources 110-10 athrough 110-10 c of the deposition assembly 100-10 may include adeposition material for forming an electron transport layer, anddeposition sources 110-11 a through 110-11 c of the deposition assembly100-11 may include a deposition material for forming an electroninjection layer. Deposition layers formed by some of the depositionassemblies 100-1, 100-2, 100-3, 100-4, 100-10, and 100-11 may becommonly formed regardless of a sub-pixel. Accordingly, a patterningslit sheet, i.e., an open mask, including one patterning slit may be maybe disposed on the deposition sources of the deposition assemblies100-1, 100-2, 100-3, 100-4, 100-10, and 100-11.

Each of other deposition assemblies 100-5, 100-6, 100-7, 100-8, and100-9 may form a patterned layer according to sub-pixels in the organiclayer 62. In other words, deposition sources 110-5 a through 110-5 c ofthe deposition assembly 100-5 may include a deposition material forforming an assistant layer of red and green sub-pixels, depositionsources 110-6 a through 110-6 c of the deposition assembly 100-6 mayinclude a deposition material for forming an assistant layer of a redsub-pixel, deposition sources 110-7 a through 110-7 c of the depositionassembly 100-7 may include a deposition material for forming a redemission layer, deposition sources 110-8 a through 110-8 c of thedeposition assembly 100-8 may include a deposition material for forminga green emission layer, and deposition sources 110-9 a through 110-9 cof the deposition assembly 100-9 may include a deposition material forforming a blue emission layer.

The patterning slit sheet 130 including the plurality of patterningslits 131 may be located at the deposition sources of the depositionassemblies 100-5, 100-6, 100-7, 100-8, and 100-9.

However, the present invention is not limited thereto and the organiclayer deposition apparatus according to an embodiment of the presentinvention may include two or more deposition assemblies and each of thedeposition assembles may include one or more deposition sources. Also,any suitable one of various types of deposition materials may beincluded in a deposition source according to a device structure.

FIGS. 17 and 18 are schematic plan views that illustrate operations ofmodification shutters 141-1 through 141-11, according to an embodimentof the present invention. FIG. 17 is a plan view before the modificationshutters 141-1 through 141-11 are respectively located on the depositionassemblies 100-1 through 100-11, and FIG. 18 is a plan view after themodification shutters 141-1 through 141-11 are respectively located onthe deposition assemblies 100-1 through 100-11.

As shown in FIG. 18, the modification shutters 141-1 through 141-11 maybe located between the deposition source 110 and the patterning slitsheet 130, and may respectively include openings 142-1 through 142-11configured to allow the deposition material 115 to pass-through towardsthe patterning slit sheet 130. The openings 142-1 through 142-11 may beelongated in a first direction A. The openings 142-1 through 142-11 ofthe modification shutters 141-1 through 141-11 are parallel to the firstdirection A in lengths, but have different locations. In other words,the openings 142-1 through 142-11 may be configured to be offset fromeach other along a direction (second direction) perpendicular to thefirst direction A. Accordingly, when the deposition materials thatpassed through the openings 142-1 through 142-11 form pattern layersdeposited on a modifying substrate 2, the pattern layers formed by thedeposition assemblies 100-1 through 100-11 do not overlap each other.Because there are a total of 11 deposition assemblies 100-1 through100-11 in FIGS. 17 and 18, 11 un-overlapping pattern layers may beformed through the openings 142-1 through 142-11 along the seconddirection.

Generally, the deposition unit 100 of FIG. 1 includes m organic layerdeposition assemblies, and each of the m organic layer depositionassemblies may include n deposition sources and one modificationshutter. Here, m and n may each be a natural number greater than orequal to 2.

When a thickness of an organic layer is measured, the (n−1)th depositionsource may be activated, and a modifying substrate (e.g., the substrateon which organic layers are to be deposited for thickness measurement)may be transferred (or transported) in a first direction and adeposition material from the activated (n−1)th deposition source may bedeposited on the modifying substrate while deposition materials fromother deposition sources other than the (n−1)th deposition source areblocked from reaching the modifying substrate. When the modifyingsubstrate is out of a deposition unit, the (n)th deposition source isactivated, and the modifying substrate is transferred in the firstdirection and a deposition material from the activated (n)th depositionsource may be deposited on the modifying substrate while depositionmaterials of other deposition sources other than the (n)th depositionsource are blocked from reaching the modifying substrate. Referring toFIGS. 17 and 18, the modification shutters 141-1 through 141-11 may beused to measure thicknesses of organic layers formed on a substrate.

For example, the modification shutters 141-1 through 141-11 are locatedat one side of the deposition sources 110-1 a, 110-1 b, 110-1 c, . . . ,110-11 a, 110-11 b, 110-11 c as shown in FIG. 17 before measuring thethicknesses of organic layers, and when the thicknesses are to bemeasured, the modification shutters 141-1 through 141-11 are arranged onthe deposition sources 110-1 a, 110-1 b, 110-1 c, . . . , 110-11 a,110-11 b, 110-11 c as shown in FIG. 18. Then, a deposition process maybe performed as the modifying substrate 2 moves along the firstdirection A. When the deposition process is performed on the modifyingsubstrate 2, the deposition sources 110-1 a, 110-2 a, . . . , 110-11 anearest to the modifying substrate 2 before transference from among thedeposition sources 110-1 a, 110-1 b, 110-1 c, . . . , 110-11 a, 110-11b, 110-11 c are activated and the deposition materials of the depositionsources 110-1 a, 110-2 a, . . . , 110-11 a are deposited on themodifying substrate 2. Here, deposition sources 110-1 b, 110-1 c, 110-2b, 110-2 b, . . . , 110-11 b, 110-11 c other than the deposition sources110-1 a, 110-2 a, . . . , 110-11 a may be stopped from being activatedor blocked by the shielding member 140 of FIG. 3 such that thedeposition materials thereof do not reach the modifying substrate 2.

After the deposition processes are all performed by the depositionsources 110-1 a, 110-2 a, . . . , 110-11 a, deposition sources 110-1 b,110-2 b, 110-11 b adjacent to the deposition sources 110-1 a, 110-2 a, .. . , 110-11 a are activated, and other deposition sources 110-1 a,110-1 c, 110-2 a, 110-2 c, . . . , 110-11 a, 110-11 c are stopped frombeing activated or blocked by the shielding member 140 such that thedeposition materials thereof do not reach the modifying substrate 2.

When the deposition process for measuring the thickness of the organiclayer is performed as such, the number of modifying substrates 2 equalto the number of deposition sources included in one deposition assemblyis used to measure the thickness of the organic layer. For example,referring to FIGS. 17 and 18, because three deposition sources areincluded in each of the deposition assemblies 100-1 through 100-11,three modifying substrates 2 may be used to measure the thickness of theorganic layer formed by each of the deposition sources 110-1 a, 110-1 b,110-1 c, . . . , 110-11 a, 110-11 b, 110-11 c.

By using such modification shutters 141-1 through 141-11, thethicknesses of the organic layers deposited on the three modifyingsubstrates 2 by each deposition sources may be measured. In other words,when the modification shutters 141-1 through 141-11 having the openings142-1 through 142-11 that are offset from each other are not used, thenumber of modifying substrates 2 equal to the number of the depositionsources 110-1 a, 110-1 b, 110-1 c, . . . , 110-11 a, 1101-11 b, 110-11 cmay be required to measure the thickness of the organic layer formed byeach deposition source. However, because the modification shutter 141-1through 141-11 respectively include the openings 142-1 through 142-11that are offset from each other, the organic layers formed by thedeposition sources of the deposition assemblies 100-1 through 100-11 donot overlap each other. Thus, the thicknesses of the organic layersformed by the deposition sources of the deposition assemblies 100-1through 100-11 may be measured by using the number of modifyingsubstrates 2 equal to the number of the deposition sources included ineach of the deposition assemblies 100-1 through 100-11. Accordingly,times required to measure and compensate for the thickness of theorganic layer may be reduced, and costs for measuring and compensatingfor the thickness of the organic layer may be reduced.

FIG. 19 is a schematic perspective view of an organic layer depositionassembly 700 according to another embodiment of the present invention,FIG. 20 is a schematic side-sectional view of the organic layerdeposition assembly 700 of FIG. 19, and FIG. 21 is a schematic plansectional view of the organic layer deposition assembly 700 of FIG. 19.

Referring to FIGS. 19 to 21, the organic layer deposition assembly 700according to the present embodiment includes a deposition source 710, adeposition source nozzle unit 720, a shielding assembly (e.g., a barrierassembly or a barrier plate assembly) 730, and a patterning slit sheet750.

The deposition source 710 includes a crucible 711 that is filled with adeposition material 715 and a heater 712 that heats the crucible 711 soas to vaporize the deposition material 715 toward the deposition sourcenozzle unit 720. The deposition source nozzle unit 720 is located at aside of the deposition source 710. The deposition source nozzle unit 720includes a plurality of deposition source nozzles 721 arranged along anX-axis direction.

In addition, the shielding plate assembly 730 is located at a side ofthe deposition source nozzle unit 720. The shielding plate assembly 730includes a plurality of shielding plates (e.g., barrier plates) 731, anda shielding frame 732 located outside (e.g., around or surrounding) theshielding plates 731. The shielding plates 731 may be arranged parallelto each other along the X-axis direction. In this regard, the shieldingplates 731 may be equidistant from each other. In addition, theshielding plates 731 may extend along a YZ plane, as illustrated in FIG.19, and may be rectangular. The shielding plates 731 may divide (e.g.,define) a space between the deposition source nozzle unit 720 and thepatterning slit sheet 750 into a plurality of deposition spaces S. Thatis, in the organic layer deposition assembly 700 according to thepresent embodiment, due to the shielding plates 731, as illustrated inFIG. 19, each of the deposition source nozzles 721 through whichdeposition materials are emitted has a deposition space S. As describedabove, because the shielding plates 731 divide a space between thedeposition source nozzle unit 720 and the patterning slit sheet 750 intoa plurality of deposition spaces S, a deposition material ejected fromone deposition source nozzle 721 may not be mixed with a depositionmaterial ejected from another deposition source nozzle 721 and may passthrough a patterning slit 751 of the patterning slit sheet 750 to bedeposited on a substrate 2 attached to an electrostatic chuck 600. Thatis, the shielding plates 731 may prevent deposition materials ejected(or discharged) through the respective deposition source nozzles 721from being dispersed and may guide their movement paths, that is, guidethem to move in a Z-axis direction.

As described above, the shielding plates 731 may provide linearity of adeposition material, and thus, the size of shadows formed on thesubstrate 2 may be reduced (e.g., substantially reduced), andaccordingly, it is possible to keep the organic layer depositionassembly 700 spaced apart from the substrate 2 by a certain distance(e.g., a gap).

In one embodiment, the patterning slit sheet 750 may be located betweenthe deposition source 710 and the substrate 2. The patterning slit sheet750 may further include a frame 755 having a shape similar to a windowframe. The patterning slit sheet 750 includes patterning slits 751arranged in the X-axis direction with regions or spacers 752therebetween. The deposition material 715 that has been vaporized in thedeposition source 710 passes through the deposition source nozzle unit720 and the patterning slit sheet 750 and then moves toward thesubstrate 2.

FIG. 22 is a schematic perspective view of an organic layer depositionassembly 800 according to another embodiment of the present invention.

Referring to FIG. 22, an organic layer deposition assembly 800 accordingto the present embodiment includes a deposition source 810, a depositionsource nozzle unit 820, a first shielding plate assembly (e.g., a firstbarrier plate assembly) 830, a second shielding plate assembly (e.g., asecond barrier plate assembly) 840, and a patterning slit sheet 850. Inthis regard, detailed structures of the deposition source 810, the firstshielding plate assembly 830, and the patterning slit sheet 850 aresubstantially the same as described with reference to the embodimentillustrated in FIG. 19, and thus, description thereof is not presentedherein. The organic layer deposition assembly 800 according to thepresent embodiment is different from the organic layer depositionassembly 700 according to the previous embodiment in that the secondshielding plate assembly 840 is located at one side of the firstshielding plate assembly 830.

For example, the second shielding plate assembly 840 includes aplurality of second shielding plates (e.g., barrier plates) 841, and asecond shielding frame 842 located outside (e.g., around or surrounding)the second shielding plates 841. The second shielding plates 841 may bearranged in parallel to each other along the X-axis direction. In thisregard, the second shielding plates 841 may be equidistant from eachother. In addition, the respective second shielding plates 841 may beformed to be (arranged in) parallel to a YZ plane in FIG. 22, that is,may be formed (e.g., arranged or oriented) in a direction perpendicularto the X-axis direction.

The first shielding plates 831 and the second shielding plates 841arranged as described above may divide a space between the depositionsource nozzle unit 820 and the patterning slit sheet 850. That is, dueto the first shielding plates 831 and the second shielding plates 841,the deposition space is divided into a plurality of deposition spacesrespectively corresponding to the deposition source nozzles 821 throughwhich deposition materials are ejected.

In this regard, the second shielding plates 841 may be locatedcorrespondingly to the first shielding plates 831, respectively. Inother words, the respective second shielding plates 841 are aligned withthe respective first shielding plates 831 such that the respectivesecond shielding plates 841 are parallel to the respective firstshielding plates 831. That is, a first shielding plate and a secondshielding plate corresponding thereto may be located on the same plane.Although in FIG. 22, widths (or thicknesses) of the first shieldingplates 831 in the X-axis direction appear to be the same as X-axisdirection widths of the second shielding plates 841, embodiments of thepresent invention are not limited thereto. That is, the second shieldingplates 841 that require fine alignment with patterning slits 851 may beformed to be relatively thin, and the first shielding plates 831 that donot require fine alignment with the patterning slits 851 may be formedto be relatively thick, enabling ease of manufacturing thereof. Regionsor spacers 852 are between the patterning slits 851.

FIG. 23 is a schematic perspective view of an organic layer depositionassembly 900 according to another embodiment of the present invention.

Referring to FIG. 23, the organic layer deposition assembly 900according to the present embodiment includes a deposition source 910, adeposition source nozzle unit 920, and a patterning slit sheet 950.

The deposition source 910 includes a crucible 911 that is filled withthe deposition material 915 and a heater 912 that heats the crucible 911so as to vaporize the deposition material 915 toward the depositionsource nozzle unit 920. The deposition source nozzle unit 920 is locatedat one side of the deposition source 910. The deposition source nozzleunit 920 includes a plurality of deposition source nozzles 921 arrangedalong the Y-axis direction. In one embodiment, the patterning slit sheet950 and a frame 955 may be further located between the deposition source910 and a substrate 2 attached to an electrostatic chuck 600, and thepatterning slit sheet 950 may have a plurality of patterning slits 951and spacers (or regions) 952 arranged along the X-axis direction. Thedeposition source 910 and the deposition source nozzle unit 920 may beconnected to the patterning slit sheet 950 by a connection member 935.

The present embodiment is different from the previous embodiments in thearrangement of the deposition source nozzles 921 included in thedeposition source nozzle unit 920. The difference is described in detailbelow.

The deposition source nozzle unit 920 is located at one side of thedeposition source 910, for example, a side of the deposition source 910toward the substrate 2. In addition, the deposition source nozzle unit920 includes deposition source nozzles 921 arranged along the Y-axisdirection (that is, the scan direction of the substrate 2). In thisregard, the deposition source nozzles 921 may be equidistant from eachother. The deposition material 915 that has been vaporized in thedeposition source 910 passes through the deposition source nozzle unit920 and is then moved toward the substrate 2. Ultimately, in an organiclayer deposition assembly 900, the deposition source nozzles 921 arearranged along the scan direction of the substrate 2. In this regard, ifdeposition source nozzles 921 are arranged along the X-axis direction,an interval between each of the deposition source nozzles 921 and thepatterning slit 951 may vary and in this case, a shadow may be formeddue to a deposition material ejected from a deposition source nozzlethat is located relatively far from the patterning slit 951.Accordingly, forming only one deposition source nozzle 921 along theX-axis direction as in the present embodiment may contribute to asubstantial decrease in the formation of shadows. In addition, becausethe deposition source nozzles 921 are arranged along the scan direction,even when a flux difference occurs between individual deposition sourcenozzles, the flux difference may be offset and thus depositionuniformity may be maintained constant (or substantially constant).

Hereinafter, a structure of an organic layer formed using an organiclayer deposition apparatus according to an embodiment of the presentinvention is described in more detail.

FIG. 24 is a schematic view illustrating equidistant patterning slits131 of the patterning slit sheet 130 of an organic layer depositionapparatus, and FIG. 25 is a schematic view of an organic layer that isformed by using the patterning slit sheet 130 of FIG. 24.

FIGS. 24 and 25 illustrate the patterning slit sheet 130 in which thepatterning slits 131 are equidistant to each other. That is, in FIG. 24,the patterning slits 131 satisfy the following condition: I₁=I₂=I₃=I₄.

In this embodiment, an incident angle of a deposition materialdischarged along a center line C of a deposition space S issubstantially perpendicular to the substrate 2. Thus, an organic layerP₁ formed using the deposition material that has passed through apatterning slit 131 a has a shadow with a minimum (or reduced) size, anda right-side shadow SR₁ and a left-side shadow SL₁ are formedsymmetrical to (or symmetrically with) each other.

However, a critical incident angle θ of the deposition material thatpasses through patterning slits located farther from the center line Cof the deposition space S gradually increases, and thus, the criticalincident angle θ of the deposition material that passes through anoutermost patterning slit 131 e is approximately 55°. Accordingly, thedeposition material is incident at an inclination with respect to thepatterning slit 131 e, and an organic layer P₅ formed using thedeposition material that has passed through the patterning slit 131 ehas the largest shadow. For example, a left-side shadow SL₅ is largerthan a right-side shadow SR₅.

That is, as the critical incident angle θ of the deposition materialincreases, the size of the shadow also increases. For example, the sizeof the shadow at a position farther from the center line C of thedeposition space S increases. In addition, the critical incident angle θof the deposition material increases as a distance between the centerline C of the deposition space S and the respective patterning slitsincreases. Thus, organic layers formed using the deposition materialthat passes through the patterning slits located farther from the centerline C of the deposition space S have a larger shadow size. For example,of the shadows on both sides of the respective organic layers, the sizeof the shadow at a position farther from the center line C of thedeposition space S is larger than that of the other.

That is, referring to FIG. 25, the organic layers formed on the leftside of the center line C of the deposition space S have a structure inwhich a left hypotenuse (a slanted side on the left between top andbottom sides) is larger than a right hypotenuse (a slanted side on theright between top and bottom sides), and the organic layers formed onthe right side of the center line C of the deposition space S have astructure in which a right hypotenuse (e.g., a right slanted side) islarger than a left hypotenuse (e.g., a left slanted side).

Also, in the organic layers formed on the left side of the center line Cof the deposition space S, the length of the left hypotenuse (e.g., theleft slanted side) increases towards the left. In the organic layersformed on the right side of the center line C of the deposition space S,the length of the right hypotenuse (e.g., the right slanted side)increases towards the right. Consequently, the organic layers formed inthe deposition space S may be formed symmetrical to each other about thecenter line C of the deposition space S.

This structure will now be described in more detail.

The deposition material that passes through a patterning slit 131 bpasses through the patterning slit 131 b at a critical incident angle ofθ_(b), and an organic layer P₂ formed using the deposition material thathas passed through the patterning slit 131 b has a left-side shadowhaving a size of SL₂. Likewise, the deposition material that passesthrough a patterning slit 131 c passes through the patterning slit 131 cat a critical incident angle of θ_(c), and an organic layer P₃ formedusing the deposition material that has passed through the patterningslit 131 c has a left-side shadow having a size of SL₃. Likewise, thedeposition material that passes through a patterning slit 131 d passesthrough the patterning slit 131 d at a critical incident angle of θ_(d),and an organic layer P₄ formed using the deposition material that haspassed through the patterning slit 131 d has a left-side shadow having asize of SL₄. Likewise, the deposition material that passes through thepatterning slit 131 e passes through the patterning slit 131 e at acritical incident angle of θ_(e), and an organic layer P₅ formed usingthe deposition material that has passed through the patterning slit 131e has a left-side shadow having a size of SL₅.

In this regard, the critical incident angles satisfy the followingcondition: θ_(b)<θ_(c)<θ_(d)<θ_(e), and thus, the sizes of the shadowsof the organic layers also satisfy the following condition:SL₁<SL₂<SL₃<SL₄<SL₅.

FIG. 26 is a schematic cross-sectional view of an active matrix-typeorganic light-emitting display apparatus that is manufactured using anorganic layer deposition apparatus according to an embodiment of thepresent invention.

Referring to FIG. 26, the active matrix organic light-emitting displayapparatus 10 according to the present embodiment is formed on asubstrate2. The substrate 2 may be formed of a transparent material, forexample, glass, plastic, or metal. An insulating layer 51, such as abuffer layer, is formed on an entire surface of the substrate 2. Theinsulating layer 51 may be omitted in other embodiments.

A thin film transistor (TFT) and an organic light-emitting diode (OLED)are disposed on the insulating layer 51, as illustrated in FIG. 17.

A semiconductor active layer 52 is formed on an upper surface of theinsulating layer 51 in a set or predetermined pattern. A gate insulatinglayer 53 is formed to cover the semiconductor active layer 52. Thesemiconductor active layer 52 may include a p-type or n-typesemiconductor material.

A gate electrode 54 of the TFT is formed in a region of the gateinsulating layer 53 corresponding to the semiconductor active layer 52.An interlayer insulating layer 55 is formed to cover the gate electrode54. After the interlayer insulating layer 55 is formed, the interlayerinsulating layer 55 and the gate insulating layer 53 are etched by, forexample, dry etching, to form contact holes respectively exposing partsof the semiconductor active layer 52.

Source/drain electrodes 56 and 57 are formed on the interlayerinsulating layer 55 to contact the semiconductor active layer 52 throughthe respective contact holes. A passivation layer 58 is formed to coverthe source/drain electrodes 56 and 57, and is etched to expose a part ofone of the source/drain electrodes 56 and 57. An insulating layer 59 maybe further formed on the passivation layer 58 so as to planarize thepassivation layer 58.

In addition, the OLED displays image information (e.g., set orpredetermined image information) by emitting red, green, or blue lightaccording to current. The OLED includes a first electrode 61 located onthe passivation layer 58. The first electrode 61 is electricallyconnected to the exposed source/drain electrodes 56 and 57 of the TFT.

A pixel defining layer 60 is formed to cover the first electrode 61. Anopening is formed in the pixel-defining layer 60, and an organic layer62, including an emission layer (EML), is formed in a region defined bythe opening. A second electrode 63 is formed on the organic layer 62.

The pixel-defining layer 60, which defines individual pixels, may beformed of an organic material. The pixel-defining layer 60 alsoplanarizes the surface of a region of the substrate 2, in which thefirst electrode 61 is formed, and in particular, the surface of theinsulating layer 59.

The first electrode 61 and the second electrode 63 are electricallyinsulated from each other, and respectively apply voltages of oppositepolarities to the organic layer 62 to induce light emission.

The organic layer 62, including an EML, may be formed of a low-molecularweight organic material or a high-molecular weight organic material.When a low-molecular weight organic material is used, the organic layer62 may have a single or multi-layer structure including a hole injectionlayer (HIL), a hole transport layer (HTL), the EML, an electrontransport layer (ETL), and/or an electron injection layer (EIL).

Non-limiting examples of available organic materials may include copperphthalocyanine (CuPc), N,N′-di(naphthalene-1-yl)-N,N′-diphenyl-benzidine(NPB), and tris-8-hydroxyquinoline aluminum (Alq3).

The organic layer 62, including an EML, may be formed using the organiclayer deposition apparatus according to embodiments of the presentinvention (for example, see organic layer deposition apparatus 1 of FIG.1). That is, an organic layer deposition apparatus is disposed spacedapart by a set or predetermined distance from a substrate on which thedeposition material is to be deposited, wherein the organic layerdeposition apparatus includes a deposition source that discharges adeposition material, a deposition source nozzle unit that is located atone side of the deposition source, wherein the deposition source nozzleunit includes a plurality of deposition source nozzles formed therein,and a patterning slit sheet that faces the deposition source nozzleunit, wherein the patterning slit sheet includes a plurality ofpatterning slits formed therein. Then, while one of the organic layerdeposition apparatus (see 1 of FIG. 1) or a substrate (see 2 of FIG. 1)is relatively moved, the deposition material ejected from the organiclayer deposition apparatus (for example, see organic layer depositionapparatus 1 of FIG. 1) is deposited on the substrate (for example, seesubstrate 2 of FIG. 1).

After the organic layer 62 is formed, the second electrode 63 may beformed by the same (or substantially the same) deposition method as usedto form the organic layer 62.

The first electrode 61 may function as an anode, and the secondelectrode 63 may function as a cathode. Alternatively, the firstelectrode 61 may function as a cathode, and the second electrode 63 mayfunction as an anode. The first electrode 61 may be patterned tocorrespond to individual pixel regions, and the second electrode 63 maybe formed to cover all the pixels (e.g., cover substantially an entirearea of the substrate).

The first electrode 61 may be formed as a transparent electrode or areflective electrode. Such a transparent electrode may be formed ofindium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), orindium oxide (In₂O₃). Such a reflective electrode may be formed byforming a reflective layer from silver (Ag), magnesium (Mg), aluminum(Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium(Nd), iridium (Ir), chromium (Cr), or a compound thereof, and forming alayer of ITO, IZO, ZnO, or In₂O₃ on the reflective layer. The firstelectrode 61 may be formed by forming a layer by, for example,sputtering, and then patterning the layer by, for example,photolithography.

The second electrode 63 may also be formed as a transparent electrode ora reflective electrode. When the second electrode 63 is formed as atransparent electrode, the second electrode 63 may be used as a cathode.To this end, such a transparent electrode may be formed by depositing ametal having a low work function, such as lithium (Li), calcium (Ca),lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminum (LiF/Al),aluminum (Al), silver (Ag), magnesium (Mg), or a compound thereof, on asurface of the organic layer 62, and forming an auxiliary electrodelayer or a bus electrode line thereon from ITO, IZO, ZnO, In₂O₃, or thelike. When the second electrode 63 is formed as a reflective electrode,the reflective electrode may be formed by depositing Li, Ca, LiF/Ca,LiF/Al, Al, Ag, Mg, or a compound thereof on the entire surface of theorganic layer 62. The second electrode 63 may be formed using the samedeposition method as used to form the organic layer 62 described above.

The organic layer deposition apparatuses according to the embodiments ofthe present invention described above may be applied to form an organiclayer or an inorganic layer of an organic TFT, and to form layers fromvarious suitable materials.

According to embodiments of the present invention, an organic layerdeposition apparatus that is suitable for use in a mass production ofdevices on a large substrate, enables high-definition patterning,enables a thickness of an organic layer to be corrected in a reducedtime, leading to a high operation rate of the organic layer depositionapparatus, and enables costs for the correction of a thickness of anorganic layer to be reduced to decrease manufacturing costs of theorganic light-emitting display apparatus, a method of manufacturing anorganic light-emitting display apparatus by using the same, and anorganic light-emitting display apparatus manufactured using the method,may be provided.

As described above, the one or more embodiments of the present inventionprovide organic layer deposition apparatuses that are suitable for usein the mass production of a large substrate and enable high-definitionpatterning, methods of manufacturing organic light-emitting displayapparatuses by using the same, and organic light-emitting displayapparatuses manufactured using the methods. Although some embodiments ofthe present invention have been shown and described, it would beappreciated by those skilled in the art that changes may be made tothese embodiments without departing from the principles and spirit ofthe present invention, the scope of which is defined in the claims andtheir equivalents.

What is claimed is:
 1. A method of manufacturing an organiclight-emitting display device by using an organic layer depositionapparatus for forming an organic layer on a substrate, the methodcomprising: attaching the substrate to a transfer unit in a loadingunit; transporting, into a chamber, the transfer unit to which thesubstrate is attached, by using a first conveyer unit passing throughthe chamber; forming organic layers by depositing deposition materialsdischarged from a plurality of organic layer deposition assemblies onthe substrate while the substrate is spaced apart from and movedrelative to the organic layer deposition assemblies in the chamber;separating the substrate on which the depositing has been completed fromthe transfer unit in an unloading unit; and transporting the transferunit from which the substrate is separated to the loading unit by usinga second conveyer unit passing through the chamber, wherein each of theorganic layer deposition assemblies comprises: a plurality of depositionsources, each of the deposition sources being configured to discharge acorresponding one of the deposition materials; a deposition sourcenozzle unit at a side of each of the plurality of deposition sources andcomprising one or more deposition source nozzles; a patterning slitsheet facing the deposition source nozzle unit and comprising one ormore patterning slits; and a modification shutter located between theplurality of deposition sources and the patterning slit sheet and havingan opening that is configured to allow the corresponding ones of thedeposition materials from the deposition sources to pass-through towardsthe patterning slit sheet, wherein the openings of adjacent ones of themodification shutters are offset from each other along a seconddirection perpendicular to a first direction in which the substrate istransported, and the deposition materials discharged from the pluralityof deposition sources pass through the patterning slit sheet and aredeposited on the substrate in patterns.
 2. The method of claim 1,wherein the chamber comprises the plurality of the organic layerdeposition assemblies, and wherein deposition is sequentially performedon the substrate by using each of the plurality of the organic layerdeposition assemblies.
 3. The method of claim 1, wherein the transferunit is moved between the first conveyer unit and the second conveyerunit.
 4. The method of claim 1, wherein the first conveyer unit and thesecond conveyer unit are arranged in parallel to each other above andbelow.
 5. The method of claim 1, wherein the patterning slit sheet ofthe organic layer deposition assembly is formed smaller than thesubstrate in at least one of a first direction or the second directionperpendicular to the first direction.
 6. The method of claim 1, whereinthe opening of each of the modification shutters is elongated in thefirst direction.
 7. The method of claim 1, wherein locations of theopenings of the modification shutters are different from each other. 8.The method of claim 1, wherein, when thicknesses of the plurality oforganic layers are measured, a modifying substrate is transferredthrough the organic layer deposition apparatus, and the modificationshutter is located between the plurality of deposition sources and thepatterning slit sheet such that the deposition materials are depositedon the modifying substrate by passing through the opening of themodification shutter.
 9. The method of claim 8, wherein a depositionunit of the organic layer deposition assemblies comprises m organiclayer deposition assemblies, each of the m organic layer depositionassemblies comprises n deposition sources, and each of the m organiclayer deposition assemblies comprises one modification shutter, whereinm and n are natural numbers.
 10. The method of claim 9, wherein, whenthe thicknesses of the plurality of organic layers are measured, the(n−1)th deposition source is activated, and the modifying substrate istransferred in the first direction and the deposition material isdeposited on the modifying substrate from the activated (n−1)thdeposition source while the deposition materials of the depositionsources other than the (n−1)th deposition source are blocked fromreaching the modifying substrate, and after the modifying substrate isout of the deposition unit, the (n)th deposition source is activated,and the modifying substrate is transferred in the first direction andthe deposition material is deposited on the modifying substrate from theactivated (n)th deposition source while the deposition materials of thedeposition sources other than the (n)th deposition source are blockedfrom reaching the modifying substrate.
 11. An organic light-emittingdisplay device comprising: a substrate; at least one thin filmtransistor on the substrate and comprising a semiconductor active layer,a gate electrode insulated from the semiconductor active layer, andsource and drain electrodes each contacting the semiconductor activelayer; a plurality of pixel electrodes on the at least one thin filmtransistor; a plurality of organic layers on the plurality of the pixelelectrodes; and a counter electrode located on the plurality of organiclayers, wherein a length of a slanted side between top and bottom sidesof at least one of the plurality of organic layers on the substratefarther from a center of a deposition region is larger than lengths ofslanted sides between respective top and bottom sides of other ones ofthe plurality of organic layers formed closer to the center of thedeposition region, and the at least one of the plurality of organiclayers on the substrate is a linearly-patterned organic layer formedusing the method of claim
 1. 12. A method of using an apparatus fororganic layer deposition for forming an organic material layer on asubstrate, the method comprising: transporting into a channel, atransfer unit on which the substrate is fixed by a first conveyer unitthat is configured to pass through a chamber; forming organic layers onthe substrate, when a plurality of organic layer deposition assembliesare a set distance apart from the substrate, the substrate being movedrelative to the organic layer deposition assemblies and the organicmaterial layers being formed as deposition materials emitted by theorganic layer deposition assemblies are deposited on the substrate; andtransporting the transfer unit from which the substrate is detached backby a second conveyer unit that is configured to pass through thechamber, wherein the forming of the organic material layers comprises anoperation in which, while the substrate for tooling is being transportedin the organic layer deposition assemblies, the deposition material isdeposited onto the tooling substrate by a first tooling shutter in whichone or more tooling slits are formed.
 13. The method of claim 12,wherein the first tooling shutter is arranged in each of the pluralityof organic layer deposition assemblies, and the tooling slits formed inthe first tooling shutters are formed to be at least partially offset toone another.
 14. The method of claim 13, wherein the first toolingshutter is arranged in an organic layer deposition assembly fordepositing a common layer, among the plurality of organic layerdeposition assemblies.
 15. The method of claim 12, wherein the firsttooling shutter is arranged to cover at least a portion of the substrateonly while the tooling substrate is being transported in the organiclayer deposition assemblies.
 16. The method of claim 12, furthercomprising an operation in which the substrate is fixed to the transferunit at a loading unit before the transfer unit is transported by thefirst conveyer unit; and an operation in which the substrate, to whichdeposition is completed, is detached from the transfer unit at anunloading unit before the transfer unit is transported back by thesecond conveyer unit.
 17. The method of claim 16, wherein the transferunit moves back and forth between the first conveyer unit and the secondconveyer unit.
 18. The method of claim 16, wherein the first conveyerunit and the second conveyer unit are arranged next to each other in avertical direction.
 19. The method of claim 16, wherein each of theorganic layer deposition assemblies comprises: a deposition source,which emits a deposition material; a deposition source nozzle unit,which is arranged at one side of the deposition source, the depositionsource nozzle unit comprising a plurality of deposition source nozzles;and a patterning slit sheet, which is arranged to face the depositionsource nozzle unit, the patterning slit sheet comprising a plurality ofpatterning slits arranged in a direction, wherein the depositionmaterial emitted by the deposition source passes through the patterningslit sheet and is deposited to form a pattern on the substrate.
 20. Themethod of claim 19, wherein, in an organic layer deposition assembly fordepositing a pattern layer among the plurality of organic layerdeposition assemblies, a second tooling shutter, which is arrangedbetween the deposition source nozzle unit and the patterning slit sheetto cover at least a portion of the substrate and includes tooling slitsformed at two opposite ends, is formed.
 21. The method of claim 20,wherein a width of the tooling slit of the second tooling shutter isgreater than a width of the patterning slit of the patterning slitsheet.
 22. The method of claim 19, wherein the patterning slit sheet ofthe organic layer deposition assembly is formed smaller than thesubstrate in at least any one of a first direction and a seconddirection perpendicular to the first direction.
 23. An organiclight-emitting display apparatus comprising: a substrate; at least onethin film transistor on the substrate and comprises a semiconductoractive layer, a gate electrode insulated from the semiconductor activelayer, and source and drain electrodes each contacting the semiconductoractive layer; a plurality of pixel electrodes on the at least one thinfilm transistor; a plurality of organic layers on the plurality of thepixel electrodes; and a counter electrode on the plurality of organiclayers, wherein a length of a slanted side between top and bottom sidesof at least one of the plurality of organic layers formed on thesubstrate farther from a center of a deposition region is larger thanlengths of slated sides between respective top and bottom sides of otherones of the plurality of organic layers closer to the center of thedeposition region, wherein the at least one of the plurality of organiclayers formed on the substrate is a linearly-patterned organic layerformed using the method of claim 5.